XC4VSX25-12FF676C datasheet, PDF

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XC4VSX25-12FF676C: DescriptionField Programmable Gate Array, 23040-Cell, CMOS, PBGA676,; CategoryProgrammable logic devices Programmable logic; File Size135KB，8 Pages; ManufacturerXILINX; Websitehttps://www.xilinx.com/

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XC4VSX25-12FF676C Overview

Field Programmable Gate Array, 23040-Cell, CMOS, PBGA676,

XC4VSX25-12FF676C Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	XILINX
Reach Compliance Code	not_compliant
JESD-30 code	S-PBGA-B676
JESD-609 code	e0
Humidity sensitivity level	4
Number of entries	320
Number of logical units	23040
Output times	320
Number of terminals	676
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA676,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
Base Number Matches	1

XC4VSX25-12FF676C Related Products

	XC4VSX25-12FF676C	XC4VLX60-12FF676C	XC4VLX40-12FF676C	XC4VSX35-12FF676C	XC4VFX12-12FF676C
Description	Field Programmable Gate Array, 23040-Cell, CMOS, PBGA676,	Field Programmable Gate Array, 59904-Cell, CMOS, PBGA676,	Field Programmable Gate Array, 41472-Cell, CMOS, PBGA676,	Field Programmable Gate Array, 34560-Cell, CMOS, PBGA676,	Field Programmable Gate Array, 12312-Cell, CMOS, PBGA676,
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	S-PBGA-B676	S-PBGA-B676	S-PBGA-B676	S-PBGA-B676	S-PBGA-B676
JESD-609 code	e0	e0	e0	e0	e0
Humidity sensitivity level	4	4	4	4	4
Number of entries	320	448	448	448	320
Number of logical units	23040	59904	41472	34560	12312
Output times	320	448	448	448	320
Number of terminals	676	676	676	676	676
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA676,26X26,40	BGA676,26X26,40	BGA676,26X26,40	BGA676,26X26,40	BGA676,26X26,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225	225	225	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30
Maker	XILINX	XILINX	-	-	XILINX

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