Standard SRAM, 32KX32, 12ns, CMOS, PQFP100, TQFP-100
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFP |
| package instruction | TQFP-100 |
| Contacts | 100 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Maximum access time | 12 ns |
| I/O type | COMMON |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 20 mm |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 100 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX32 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum standby current | 0.005 A |
| Maximum slew rate | 0.14 mA |
| Maximum supply voltage (Vsup) | 3.63 V |
| Minimum supply voltage (Vsup) | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| Base Number Matches | 1 |
| IS61C632A-12TQ | IS61C632A-10PQ | IS61C632A-12PQ | IS61C632A-10TQ | |
|---|---|---|---|---|
| Description | Standard SRAM, 32KX32, 12ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 32KX32, 12ns, CMOS, PQFP100, PLASTIC, QFP-100 | Standard SRAM, 32KX32, 10ns, CMOS, PQFP100, TQFP-100 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | QFP | QFP | QFP | QFP |
| package instruction | TQFP-100 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | TQFP-100 |
| Contacts | 100 | 100 | 100 | 100 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Maximum access time | 12 ns | 10 ns | 12 ns | 10 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 20 mm | 20 mm | 20 mm | 20 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 100 | 100 | 100 | 100 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32KX32 | 32KX32 | 32KX32 | 32KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | QFP | QFP | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.63X.87 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 3.22 mm | 3.22 mm | 1.6 mm |
| Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| Maximum slew rate | 0.14 mA | 0.155 mA | 0.14 mA | 0.15 mA |
| Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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