IS61NLF51218A-7.5B3I datasheet, PDF

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IS61NLF51218A-7.5B3I: DescriptionZBT SRAM, 512KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165; Categorystorage storage; File Size524KB，37 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61NLF51218A-7.5B3I Overview

ZBT SRAM, 512KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165

IS61NLF51218A-7.5B3I Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA
package instruction	TBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Factory Lead Time	10 weeks
Maximum access time	7.5 ns
Other features	FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)	117 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.05 A
Minimum standby current	3.14 V
Maximum slew rate	0.28 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm
Base Number Matches	1

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IS61NLF25636A/IS61NVF25636A

IS61NLF51218A/IS61NVF51218A

256K x 36 and 512K x 18

9Mb, FLOW THROUGH 'NO WAIT' STATE BUS SRAM

AUGUST 2011

FEATURES

• 100 percent bus utilization

• No wait cycles between Read and Write

• Internal self-timed write cycle

• Individual Byte Write Control

• Single Read/Write control pin

• Clock controlled, registered address,

data and control

DESCRIPTION

The 9 Meg 'NLF/NVF' product family feature high-speed,

low-power synchronous static RAMs designed to provide

a burstable, high-performance, 'no wait' state, device for

networking and communications applications. They are

organized as 256K words by 36 bits and 512K words by

18 bits, fabricated with

ISSI

's advanced CMOS technology.

Incorporating a 'no wait' state feature, wait cycles are

eliminated when the bus switches from read to write, or

write to read. This device integrates a 2-bit burst counter,

high-speed SRAM core, and high-drive capability outputs

into a single monolithic circuit.

All synchronous inputs pass through registers are controlled

by a positive-edge-triggered single clock input. Operations

may be suspended and all synchronous inputs ignored

when Clock Enable, CKE is HIGH. In this state the internal

device will hold their previous values.

All Read, Write and Deselect cycles are initiated by the ADV

input. When the ADV is HIGH the internal burst counter

is incremented. New external addresses can be loaded

when ADV is LOW.

Write cycles are internally self-timed and are initiated by

the rising edge of the clock inputs and when WE is LOW.

Separate byte enables allow individual bytes to be written.

A burst mode pin (MODE) defines the order of the burst

sequence. When tied HIGH, the interleaved burst sequence

is selected. When tied LOW, the linear burst sequence is

selected.

• Interleaved or linear burst sequence control us-

ing MODE input

• Three chip enables for simple depth expansion

and address pipelining

• Power Down mode

• Common data inputs and data outputs

•

CKE pin to enable clock and suspend operation

• JEDEC 100-pin TQFP, 119-ball PBGA, and 165-

ball PBGA packages

• Power supply:

NVF: V

2.5V (± 5%), V

ddq

2.5V (± 5%)

NLF: V

3.3V (± 5%), V

ddq

3.3V/2.5V (± 5%)

• JTAG Boundary Scan for PBGA packages

• Industrial temperature available

• Lead-free available

FAST ACCESS TIME

Symbol

Parameter

Clock Access Time

Cycle Time

Frequency

6.5

7.5

133

7.5

8.5

117

Units

MHz

liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on

any published information and before placing orders for products.

Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause

failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written

assurance to its satisfaction, that:

a.) the risk of injury or damage has been minimized;

b.) the user assume all such risks; and

c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances

Integrated Silicon Solution, Inc. — www.issi.com —

1-800-379-4774

Rev. F

08/11/2011

IS61NLF51218A-7.5B3I Related Products

	IS61NLF51218A-7.5B3I	IS61NLF51218A-7.5TQLI	IS61NLF25636A-7.5TQLI
Description	ZBT SRAM, 512KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165	ZBT SRAM, 512KX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100	ZBT SRAM, 256KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100
Is it lead-free?	Contains lead	Lead free	Lead free
Is it Rohs certified?	incompatible	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA	QFP	QFP
package instruction	TBGA, BGA165,11X15,40	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	165	100	100
Reach Compliance Code	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Factory Lead Time	10 weeks	10 weeks	10 weeks
Maximum access time	7.5 ns	7.5 ns	7.5 ns
Other features	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)	117 MHz	117 MHz	117 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B165	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e3	e3
length	15 mm	20 mm	20 mm
memory density	9437184 bit	9437184 bit	9437184 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	18	18	36
Number of functions	1	1	1
Number of terminals	165	100	100
word count	524288 words	524288 words	262144 words
character code	512000	512000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	512KX18	512KX18	256KX36
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	LQFP	LQFP
Encapsulate equivalent code	BGA165,11X15,40	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260
power supply	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.6 mm	1.6 mm
Maximum standby current	0.05 A	0.05 A	0.05 A
Minimum standby current	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.28 mA	0.28 mA	0.28 mA
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	BALL	GULL WING	GULL WING
Terminal pitch	1 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40
width	13 mm	14 mm	14 mm
Base Number Matches	1	1	-
Humidity sensitivity level	-	3	3

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