|
IRF8010STRRPBF |
IRF8010S |
Description |
mosfet N-CH 100v 80a d2pak |
SMPS MOSFET |
Is it Rohs certified? |
conform to |
incompatible |
Maker |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
package instruction |
SMALL OUTLINE, R-PSSO-G2 |
PLASTIC, D2PAK-3 |
Contacts |
3 |
3 |
Reach Compliance Code |
compliant |
unknow |
ECCN code |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
310 mJ |
310 mJ |
Shell connection |
DRAIN |
DRAIN |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
100 V |
100 V |
Maximum drain current (ID) |
75 A |
75 A |
Maximum drain-source on-resistance |
0.015 Ω |
0.015 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-PSSO-G2 |
R-PSSO-G2 |
JESD-609 code |
e3 |
e0 |
Humidity sensitivity level |
1 |
1 |
Number of components |
1 |
1 |
Number of terminals |
2 |
2 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
225 |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Maximum pulsed drain current (IDM) |
320 A |
320 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
YES |
YES |
Terminal surface |
Matte Tin (Sn) - with Nickel (Ni) barrier |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
Terminal location |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
30 |
30 |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |