AUTOMOTIVE GRADE
SURFACE MOUNT MICROPROCESSOR CRYSTAL
Page 1 of 4
SERIES H10SA
•
FEATURES
•
•
•
•
•
•
ISO/TS 16949 CERTIFIED FACILITY
RELIABILITY TESTING PER AEC-Q200
PPAP DOCUMENTATION AVAILABLE
SMALL PACKAGE OF 6.0 x 3.5 mm
EXCELLENT TOLERANCE AND STABILITY
CUSTOM SPECIFICATIONS AVAILABLE
SPECIFICATIONS
PARAMETER
FREQUENCY RANGE
MODE OF OSCILLATION
FUNDAMENTAL
VALUE
8.000 MHz to 65.000 MHz
8.000 MHz to 65.000 MHz
±50 ppm max
(±10 ppm, ±15 ppm, ±20 ppm and ±30 ppm
available)
±50
ppm max
(±10 ppm, ±15 ppm, ±20 ppm and ±30 ppm
available, see Table 2)
-20°C to +70°C Standard
-40°C to +85°C Extended
-40°C to +105°C Extended6
-40°C to +125°C Extended1
-55°C to +125°C
±1 ppm per year max
6 pF to 32 pF or Series
See Table 1
5.0 pF max
100 µW typ, 500 µW max
500 MΩ min
±5 ppm max 75 cm drop test in
3 axes onto a hard wood surface
260°C for 10 s max
FREQUENCY TOLERANCE AT 25°C
FREQUENCY STABILITY OVER TEMPERATURE
‡
OPERATING TEMPERATURE RANGE
‡
STORAGE TEMPERATURE RANGE
AGING
LOAD CAPACITANCE
EQUIVALENT SERIES RESISTANCE
SHUNT CAPACITANCE
DRIVE LEVEL
INSULATION RESISTANCE
SHOCK RESISTANCE
REFLOW CONDITIONS
‡ Not all combinations of temperature and frequency stability available, consult factory.
TABLE 1
FREQUENCY
(MHz)
8≤F0<12
12≤F0<20
20≤F0<24
24≤F0<30
30≤F0≤65
TABLE 2
ESR MAX
(Ω)
60
45
40
35
30
TEMP RANGE
(°C)
STABILITY
(ppm)
±10
±15
±20
±30
-20 to +70
O
O
O
O
-40 to +85
O
O
O
×
-40 to +105
O
×
△
△
-40 to +125
×
×
×
△
Note: O: Available,
△:
Conditional,
×:
Not available
±50
O
O
O
O
MODE
FUND
FUND
FUND
FUND
FUND
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S T R E E T
▪
M i a m i , F l o r i d a 3 3 1 7 2
▪
U . S . A .
Telephone: +1-305-593-6033
▪
Fax: +1-305-594-3973
▪
e-mail: sales@raltron.com
▪
web site: http://www.raltron.com
AUTOMOTIVE GRADE
SURFACE MOUNT MICROPROCESSOR CRYSTAL
Page 2 of 4
SERIES H10SA
PART NUMBERING SYSTEM
TYPE
H10SA
-
-
FREQUENCY
in MHz
-
-
LOAD CAPACITANCE
8 to 32 pF for Parallel
S for Series
-
TAPE & REEL
-
-
MODE
Blank for < 24.576 MHz
F for ≥ 24.576 MHz
-
-
TOLERANCE/STABLITY
(PPM/PPM)
Blank for max
ppmppm
Example: 1020, 2050
-
-
EXTENDED
TEMPERATURE
Blank for Standard
EXT for Extended
EXT6 for Extended6
EXT1 for Extended1
-
TR
EXAMPLE: H10SA-24.000-18-3050-EXT1-TR
AUTOMOTIVE GRADE Surface Mount Microprocessor Crystal, H10SA package, 6.0 x 3.5 mm, 24.000 MHz,
Fundamental mode, 18 pF Load, ±30 ppm Tolerance, ±50 ppm Stability from -40°C to +125°C, Tape and reel
packaging
MECHANICAL SPECIFICATION
CARRIER TAPE DIMENSIONS
NOTE: REFER TO EIA-481 FOR NON-SPECIFIED DIMENSIONS
PACKAGING
180 mm REEL DIAMETER
12 mm TAPE WIDTH, 8 mm PITCH
QUANTITY: 1000 PIECES PER REEL
R A L T R O N E L E C T R O N I C S
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1 0 4 0 0 N .W . 3 3
r d
S T R E E T
▪
M i a m i , F l o r i d a 3 3 1 7 2
▪
U . S . A .
Telephone: +1-305-593-6033
▪
Fax: +1-305-594-3973
▪
e-mail: sales@raltron.com
▪
web site: http://www.raltron.com
AUTOMOTIVE GRADE
SURFACE MOUNT MICROPROCESSOR CRYSTAL
Page 3 of 4
SERIES H10SA
REFLOW PROFILE
t
P
T
P
Ramp-up
Critical Zone
T
L
to T
P
T
L
T
SMAX
Temp.
[°C]
T
SMIN
t
S
Preheat
t
L
Ramp-down
t[25°C] to Peak
Time [sec]
Reflow profile (Reference IPC/JEDEC J-STD-020)
Temperature Min Preheat
Temperature Max Preheat
Time (T
SMIN
to T
SMAX
)
Temperature
Peak Temperature
Ramp-up rate
Ramp-down rate
Time within 5°C of Peak Temperature
Time t[25°C] to Peak Temperature
Time
T
SMIN
T
SMAX
t
S
T
L
T
P
R
UP
R
DOWN
t
P
t[25°C] to Peak
t
L
150°C
200°C
60-180 sec.
217°C
260°C
3°C/sec max.
6°C/sec max.
10 sec.
480 sec.
60-150 sec.
ENVIRONMENTAL
PARAMETER
MOISTURE SENSITIVITY LEVEL
RoHS
REACH SVHC
HALOGEN-FREE
TERMINATION FINISH
UNIT WEIGHT
VALUE
1
Compliant
Compliant
Compliant
Au
0.0475 g
R A L T R O N E L E C T R O N I C S
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1 0 4 0 0 N .W . 3 3
r d
S T R E E T
▪
M i a m i , F l o r i d a 3 3 1 7 2
▪
U . S . A .
Telephone: +1-305-593-6033
▪
Fax: +1-305-594-3973
▪
e-mail: sales@raltron.com
▪
web site: http://www.raltron.com
AUTOMOTIVE GRADE
SURFACE MOUNT MICROPROCESSOR CRYSTAL
Page 4 of 4
SERIES H10SA
The process of manufacturing H10SA series of Automotive Grade Surface Mount Microprocessor Crystals is
performed by using
Advanced Product Quality Planning (APQP).
This technique defines and establishes the
following actions:
•
•
•
•
•
Product design activities communicating special characteristics to the process design activity, prior to design
release, linking the DFMEA to PFMEA.
Plan, acquire and install appropriate process equipment and tooling based on design tolerances provided by
the customer. – CPPD (Collaborative Product Process Design)
Assembly personnel communicating suggestions on better ways to assemble a product prior to the completion
of the design of the product. – DFA/M (Design for Assembly and Manufacturing)
Manufacturing or Process Engineering establishing adequate Quality Controls for features of a product or
parameters of a process, which still risk potential failure. – Control Plan Methodology
Performing Stability and Capability studies on special characteristics to understand the variation present and
predict future performance. – SPC (Statistical Process Control and Process Capability)
Request for
Production Part Approval Process (PPAP)
documentation must be requested at time of
order placement. Requests for part approval will be supported in official PPAP format and with
documented results as requested at time of order placement. Actual measurements are taken of the
parts produced and are used to complete the various test sheets of PPAP.
NOTICE
If you intend to use our product referenced above in an automotive application that may result in loss of life or assets, please do
not fail to advise us of your intention beforehand. The use of the listed part in those applications is not covered by warranty, and
we will not be held accountable for any liability claims. We reserve the right to not supply parts in those circumstances.
NOVEMBER 2016
R A L T R O N E L E C T R O N I C S
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1 0 4 0 0 N .W . 3 3
r d
S T R E E T
▪
M i a m i , F l o r i d a 3 3 1 7 2
▪
U . S . A .
Telephone: +1-305-593-6033
▪
Fax: +1-305-594-3973
▪
e-mail: sales@raltron.com
▪
web site: http://www.raltron.com
Talking
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