EEWORLDEEWORLDEEWORLD

Part Number

Search

TF201209-12NM

Description
General Purpose Inductor, 0.012uH, 20%, 1 Element, Ceramic-Core, SMD
CategoryPassive components    inductor   
File Size63KB,1 Pages
ManufacturerFRONTIER
Websitehttp://www.frontierusa.com/
Download Datasheet Parametric View All

TF201209-12NM Overview

General Purpose Inductor, 0.012uH, 20%, 1 Element, Ceramic-Core, SMD

TF201209-12NM Parametric

Parameter NameAttribute value
Objectid1462160611
Reach Compliance Codeunknown
ECCN codeEAR99
core materialCERAMIC
DC Resistance0.35 Ω
Nominal inductance(L)0.012 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
Number of functions1
Number of terminals2
Minimum quality factor (at nominal inductance)8
Maximum rated current0.3 A
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsMULTILAYER
surface mountYES
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance20%
msp430f5529 interrupt notes
Defining an interrupt service routine #pragma vector=PORT1_VECTOR //P1 port interrupt vector__interruptvoid Port_1(void) //Declare interrupt service routine, named Port_1{... //Interrupt service routi...
fish001 Microcontroller MCU
Detailed explanation of multi-layer PCB stacking structure
The stacking structure is an important factor affecting the EMC performance of PCB boards and is also an important means to suppress electromagnetic interference. This article will introduce the relev...
造物工场 PCB Design
Looking for part-time engineers to cooperate
We mainly represent several first-line brands of passive components, capacitors, inductors, varistors, crystal oscillators, filters, and hope to find capable engineers to design our products into new ...
Q575870609 Recruitment
Modern Communication Technology (4th Edition)
"Modern Communication Technology (4th Edition)" describes advanced communication technology from the perspective of full-process, full-network and network integration based on the layered architecture...
arui1999 Download Centre
Are there other ways to reduce heat and power consumption of MOS besides parallel connection? The current cannot be changed. Although the internal resistance can be...
Are there other ways to reduce heat and power consumption of MOS besides parallel connection? The current cannot be changed. Although the internal resistance can be reduced by parallel connection, it ...
QWE4562009 Integrated technical exchanges
TI will broadcast [CAN SIC (Signal Improvement Function)] live at 10 am today. Learn the technology and win gifts!
From powertrain, to advanced driver assistance systems, to infotainment and safety, electronic control units (ECUs) such as the Controller Area Network (CAN) are needed in vehicles to perform differen...
EEWORLD社区 Automotive Electronics

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号