MDT10P23CCA1P datasheet, PDF - EEWORLD Datasheet

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MDT10P23CCA1P: DescriptionMicrocontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20; CategoryThe embedded processor and controller Microcontrollers and processors; File Size120KB，18 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MDT10P23CCA1P Overview

Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20

MDT10P23CCA1P Parametric

Parameter Name	Attribute value
Maker	Micron Technology
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
bit size	8
JESD-30 code	R-PDIP-T20
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2.5/5 V
Certification status	Not Qualified
RAM (bytes)	72
rom(word)	2048
ROM programmability	UVPROM
speed	20 MHz
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MDT10P23CCA1P Related Products

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Description	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO24	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP22	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP18	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO20	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO18	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP22	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20	Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP18
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
package instruction	DIP, DIP20,.3	SOP, SOP24,.4	DIP, DIP22,.3	DIP, DIP18,.3	SOP, SOP20,.4	SOP, SOP18,.4	DIP, DIP22,.3	DIP, DIP20,.3	DIP, DIP18,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8	8	8	8
JESD-30 code	R-PDIP-T20	R-PDSO-G24	R-PDIP-T22	R-PDIP-T18	R-PDSO-G20	R-PDSO-G18	R-PDIP-T22	R-PDIP-T20	R-PDIP-T18
Number of terminals	20	24	22	18	20	18	22	20	18
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP	SOP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	SOP24,.4	DIP22,.3	DIP18,.3	SOP20,.4	SOP18,.4	DIP22,.3	DIP20,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
power supply	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V	2.5/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	72	72	72	72	72	72	72	72	72
rom(word)	2048	2048	2048	2048	2048	2048	2048	2048	2048
ROM programmability	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
surface mount	NO	YES	NO	NO	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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