4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDFP14
Parameter Name | Attribute value |
Parts packaging code | DFP |
package instruction | DFP, FL14,.3 |
Contacts | 14 |
Reach Compliance Code | unknown |
Other features | RADIATION HARDENED |
series | 4000/14000/40000 |
JESD-30 code | R-CDFP-F14 |
JESD-609 code | e4 |
length | 9.525 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | NAND GATE |
MaximumI(ol) | 0.00064 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Encapsulate equivalent code | FL14,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
power supply | 5/15 V |
Prop。Delay @ Nom-Sup | 513 ns |
propagation delay (tpd) | 513 ns |
Certification status | Not Qualified |
Schmitt trigger | YES |
Filter level | MIL-PRF-38535 Class V |
Maximum seat height | 2.92 mm |
Maximum supply voltage (Vsup) | 18 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | GOLD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
total dose | 100k Rad(Si) V |
width | 6.285 mm |
Base Number Matches | 1 |
5962R9664101VXC | 5962R9664102VCC | 5962R9664101V9A | 5962R9664102VXC | 5962R9664102V9A | 5962R9664101VCC | |
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Description | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDFP14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDIP14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, UUC14, DIE-14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, UUC14 | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDIP14 |
Parts packaging code | DFP | DIP | DIE | DFP | DIE | DIP |
package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | DIE, DIE OR CHIP | DFP, FL14,.3 | DIE, DIE OR CHIP | DIP, DIP14,.3 |
Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
series | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 code | R-CDFP-F14 | R-CDIP-T14 | R-XUUC-N14 | R-CDFP-F14 | R-XUUC-N14 | R-CDIP-T14 |
JESD-609 code | e4 | e4 | e0 | e4 | e0 | e4 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP | DIP | DIE | DFP | DIE | DIP |
Encapsulate equivalent code | FL14,.3 | DIP14,.3 | DIE OR CHIP | FL14,.3 | DIE OR CHIP | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | IN-LINE | UNCASED CHIP | FLATPACK | UNCASED CHIP | IN-LINE |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
propagation delay (tpd) | 513 ns | 513 ns | 513 ns | 513 ns | 513 ns | 513 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | YES | YES | YES | YES | YES | YES |
Filter level | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
Maximum supply voltage (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | GOLD | GOLD | TIN LEAD | GOLD | TIN LEAD | GOLD |
Terminal form | FLAT | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE |
Terminal location | DUAL | DUAL | UPPER | DUAL | UPPER | DUAL |
total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
MaximumI(ol) | 0.00064 A | 0.00064 A | - | 0.00064 A | - | 0.00064 A |
Prop。Delay @ Nom-Sup | 513 ns | 513 ns | 513 ns | 513 ns | 513 ns | - |
Terminal pitch | 1.27 mm | 2.54 mm | - | 1.27 mm | - | 2.54 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |