TA-I
1. Scope :
Thick Film Chip Resistors
( Lead-Free for RM02 Series )
No
page
TRM-020S002F
1/10
This specification applies for the RM02 series of thick film chip resistors made by TA-I.
2. Construction:
Over Coat (Color : Black)
Conductor :
(Lead-free or with lead )
Sn Plating
Resistive Element
Ceramic Substrate
Ni Plating
3. Type Designation:
RM
Product Code
RM : Chip Resistor
02
Size
Power Rating
J
Tolerance
TN
Packaging
103
Nominal
Resistance
02-0201(0603) 1/20W
J -
±5%
G -
±2%
F -
±1%
D-
±0.5%
T-Paper Tape
3 digits, e.g.,:
(E-24) 103 = 10kΩ
0 = 0
Ω
4 digits, e.g.,:
(E-96) 1540 = 154Ω
43R2 = 43.2Ω
+N: Lead-Free
TA-I TECHNOLOGY CO., LTD
TA-I
4. Dimensions:
Thick Film Chip Resistors
( Lead-Free for RM02 Series )
No
page
TRM-020S002F
2/10
UNIT: mm
Type
RM02
L
0.6
±0.03
W
0.3
±0.03
C
0.1
±0.05
d
0.15
±0.05
t
0.25
±0.05
5. Ratings & Characteristics :
Type
Power
Rating
at 70℃
Rated
Voltage
Max.
Working
Voltage
Max.
Over- Load
Voltage
Resistance Range(Ω)
T.C.R
(PPM/℃)
F(±1%)
E-96
10Ω-1MΩ
G(±2%)
E-24
10Ω-1MΩ
J(±5%)
E-24
10Ω-10MΩ
1-9.1Ω
±200
RM02
1/20W
Refer 5.2
25V
50V
+600
-200
OΩ THICK FILM CHIP RESISTORS
Type
RM02
Rated Current
0.5
Max Overload Current
1
Resistance Range
50mΩ MAX
2. Operating Temp(℃): : -55℃
〜
+125℃
Note : Except for the above standardized products, we also provide the
customized products.
TA-I TECHNOLOGY CO., LTD
TA-I
5.1 Derating Curve :
Thick Film Chip Resistors
( Lead-Free for RM02 Series )
No
page
TRM-020S002F
3/10
For resistors operated at ambient temperature over 70℃ , power rating shall be derated in
accordance with figure 1.
P max.
100
Power ratio ( % )
50
0
-55
50
Figure 1
70
100
125
Ambient
Temp. (
°C
)
5.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E=
P*R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
(Ω)
E.G. : What is RM02JTN102 the rated voltage ?
RM02JTN102 P:1/20W ; R:102 = 1KΩ = 1000Ω
E=
0.05(W) * 1000(Ω)
= 7.07 (V)
TA-I TECHNOLOGY CO., LTD
TA-I
Thick Film Chip Resistors
( Lead-Free for RM02 Series )
No
page
TRM-020S002F
4/10
6. Reliability Tests: (As specified in JIS C 5202)
Test Items
Temperature
Resistance
Coefficient
of
Reference
standard
JIS-C5202-5.2
Condition of Test
-55〜 +125
℃
Test Limits
Refer 5.0
±
(3% + 0.1Ω )
Short Time Overload
JIS-C5202-5.5
2.5 X rated voltage
for
5 sec
0Ω
: 50mΩ or less
Intermittent Overload
JIS-C5202-5.8
2.5 X rated voltage or Max Overloading
voltage ,1sec “ON” , 25sec “OFF” , 10000 cycles
±
(5.0% + 0.1Ω)
0Ω :
50mΩ or less
Load Life
JIS-C5202-7.10
1000 hours at rated voltage, 70℃ , 1.5hours
“ON “, 0.5hour “OFF”
±
(5.0% + 0.1Ω)
0Ω
:
100mΩ or less
±
(5.0% + 0.1Ω)
Load Life with Humidity
JIS-C5202-7.9
1000 hours at rated voltage , 40±2℃,
90~95% RH 1.5hours “ON “, 0.5hour “OFF”
0Ω : 100mΩ or less
Without mechanical damage
±(3.0%+0.1Ω)
Rapid Change of Temperature
JIS-C5202-7.4
-55℃ (30 min. ) / +155
℃(30
min. ) 5 cycles
0Ω :
50mΩ or less
Solderability
JIS-C5202-6.11
245±5℃ solder, 2±0.5 sec dwell.
Solder : Sn96.5 / Ag3.0 / Cu0.5
At least 95% of surface area
of electrode shall be covered
with new solder.
±(1.0%+0.1Ω)
Robustness
(Bending)
of
Termination
JIS-C5202—6.1
3mm deflection
0Ω:
50mΩ or less
Dielectric
Withstanding
JIS-C5202-5.7
Voltage (Voltage Proof)
Applying voltage : 50V for a minute .
No abnormalities such as
flashover,
burning
dielectric
breakdown shall appear.
Insulation Resistance
JIS-C5202-5.6
Applying voltage 50V for 1 minute.
≧1GΩ
±(2.0%+0.1Ω)
Resistance to Dry Heat
JIS-C5202-7.2
125±5℃ for 96±4Hrs
0Ω:
50mΩ or less
±(3.0%+0.05Ω)
Resistance to Solder Heat
JIS-C5202-6.10
270
±5℃
solder , 10
±1
sec dwell .
0Ω:
50mΩ or less
TA-I TECHNOLOGY CO., LTD
TA-I
Thick Film Chip Resistors
( Lead-Free for RM02 Series )
No
page
TRM-020S002F
5/10
Component , Lead-Free Soldering part 8 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Temp. Cycles :
-35
±
5℃ / 125
±
5℃ , Keep 7 min
Testing duration : 500±4 hours
Temp. Humidity Chambers:
Temperature : 85℃
Humidity : 85% RH
Testing duration : 500±4 hours
Whisker
SONY
SS-00254-8
Whisker formation :
50 um or less .
.
Component , Lead-Free Soldering part 5 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Flow Solder :
Pre – heat : 100 to 105
℃
30±5 sec
Temperature : 260±3℃ 10 +1/ -0 sec
The entire sample shall be dipped in solder.
The specimen shall be stored at standard
atmospheric conditions for 1 hour .
Iron Solder :
Bit temperature : 350
±10℃
Application time of soldering iron : 3 +1/- 0sec
Apply the soldering iron to the electrode .
The specimen shall be stored at standard
atmospheric conditions for 1 hour , after
which the measurements shall be made
Resistance to Solder Heat
SONY
SS-00254-5
Electrical characteristics shall be
Satisfied .
Without distinct deformation in
appearance
Note* : RCWV : Rated continuous working voltage
.
7.Marking : No Marking
8.Taping & Reel :
8.1 Taping Dimensions
2 mm pitch paper :
Packing
Paper
Type
RM02
A
0.37±0.05
B
0.67±0.1
W
8.0±0.2
F
3.5±0.05
E
1.75±0.1
P
1
2.0±0.1
P
2
2.0±0.05
P
0
4.0±0.1
D
0
+0.1
ψ1.5
-0
T
0.37±0.1
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