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K8F1315ETM-FC1E

Description
Flash, 32MX16, 110ns, PBGA64
Categorystorage    storage   
File Size1MB,68 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K8F1315ETM-FC1E Overview

Flash, 32MX16, 110ns, PBGA64

K8F1315ETM-FC1E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid107508612
package instructionFBGA, BGA64,10X14,20
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
Maximum access time110 ns
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B64
memory density536870912 bit
Memory IC TypeFLASH
memory width16
Number of departments/size4,511
Number of terminals64
word count33554432 words
character code32000000
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA64,10X14,20
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
Certification statusNot Qualified
ready/busyYES
Department size16K,64K
Maximum standby current0.00002 A
Maximum slew rate0.055 mA
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE

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