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XH41N-42M-40.000MHZ

Description
XO, Clock,
CategoryPassive components    oscillator   
File Size225KB,6 Pages
ManufacturerXsis Electronics Inc.
Environmental Compliance
Download Datasheet Parametric View All

XH41N-42M-40.000MHZ Overview

XO, Clock,

XH41N-42M-40.000MHZ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid145048532048
Reach Compliance Codecompliant
Other featuresTR
maximum descent time3 ns
Frequency Adjustment - MechanicalNO
frequency stability250%
JESD-609 codee4
Installation featuresSURFACE MOUNT
Nominal operating frequency40 MHz
Maximum operating temperature230 °C
Minimum operating temperature-55 °C
Oscillator typeLVHCMOS
Output load10 KOHM, 15 pF
physical size8.89mm x 7.4mm x 3.56mm
longest rise time3 ns
Maximum supply voltage2.75 V
Minimum supply voltage2.25 V
Nominal supply voltage2.5 V
surface mountYES
maximum symmetry40/60 %
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
“XH41” Series, 7 x 9 mm
High Temperature Hybrid Microcircuit Crystal Oscillators
( 1.8 VDC, 2.5 VDC, 3.3 VDC 5.0 VDC
500 KHz to 40 MHz )
Description
Xsis Electronics “XH41” Series High Temperature
crystal oscillators are designed and processed to
operate over an extended temperature range of
-55
o
C to 230
o
C. These oscillators are offered in a
low profile, hermetically sealed resistance welded
7x9 mm ceramic package.
High temperature materials and proven processes are
utilized to provide high reliability and long life at
extreme temperatures.
In addition, the quartz crystal is mounted at four
points to provide excellent shock and vibration
resistance.
#4
#3
Marking
#1
.200 + .005
(5.08 + .13)
#2
.040
( 1.0 )
Typ.
.140 Max
(3.56)
.290 + .005
(7.4 + .13)
.018 + .003
(.46 + .08)
.350 + .005
(8.89 + .13)
.070
(1.78)
.130
(3.3)
.240 + .005
(6.1 + .13)
.008 + .001
(.20 + .03)
Features
Crystal Mounted at 4 Points
> 10KG ( 0.3 mS) Shock Resistance
1.8V, 2.5V, 3.3V & 5.0V operation options
100% testing over operating temperature range
Tristate Output Option
Low Phase Noise
Hermetically Sealed, Ceramic Package
Tape & Reel packaging
Made in USA, ECCN: EAR99
Dimensions: Inches (mm)
LEAD#
FUNCTION
E/D (Optional)
GND/CASE
OUTPUT
VDD
Typical PCB
Layout
.240
(6.1)
1
2
3
4
.200
(5.08)
Applications
Downhole Drilling Operations
High Shock & Vibration
High Temperature Avionics
Gun Launched Munitions
Jet Engine Sensors
E/D ( Enable/Disable ) Input:
A “Low”
level at the input disables the Output
into a high impedance state.
E/D
Input has internal pull-up. It can
be left floating or connected to Vdd.
Package Specifications & Outline:
Package: Ceramic 90% AL
2
O
3,
Seal: Hermetic – Resistance Welded
Weight: 0.5 Gms Typical, 0.6 Gms Max.
Thermal Resistance, Junction to Case (
θ
JC
): 30
o
C / Watt
Solder Reflow, Temp./Time: 260
o
C Max for 10 Seconds Max.
Pad Finish: 1.27 to 2.2
μm
gold over 1.27 to 8.9
μm
nickel
Hot Solder Tinning per MIL-PRF-55310 is optional at additional cost.
Contact Xsis Electronics
at xsis@xsis.com for any special requirements.
Rev 06 /17
Page 1 of 6
Xsis Electronics, Inc.,
12620 W. 63rd St., Shawnee, KS 66216 Tel. 913-631-0448 Fax. 913-631-1170, www.xsis.com, email xsis@xsis.com

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