Data Conversion IC Development Tools ADS5500 Eval Mod
| Parameter Name | Attribute value |
| Product Attribute | Attribute Value |
| Manufacturer | Texas Instruments |
| Product Category | Data Conversion IC Development Tools |
| Shipping Restrictions | This product may require additional documentation to export from the United States. |
| RoHS | N |
| Product | Evaluation Boards |
| Type | ADC |
| Tool Is For Evaluation Of | ADS5500 |
| Operating Supply Voltage | 3.3 V to 5 V |
| Interface Type | SMA |
| Factory Pack Quantity | 1 |
| ADS5500EVM | ADS5500IPAPG4 | ADS5500IPAPRG4 | |
|---|---|---|---|
| Description | Data Conversion IC Development Tools ADS5500 Eval Mod | Analog to Digital Converters - ADC 14-Bit 125MSPS ADC | Analog to Digital Converters - ADC 14-Bit 125MSPS ADC |
| Is it lead-free? | - | Lead free | Lead free |
| Is it Rohs certified? | - | conform to | conform to |
| Maker | - | Texas Instruments | Texas Instruments |
| Parts packaging code | - | QFP | QFP |
| package instruction | - | PLASTIC, HTQFP-64 | PLASTIC, HTQFP-64 |
| Contacts | - | 64 | 64 |
| Reach Compliance Code | - | unknown | unknown |
| ECCN code | - | 3A991.C.3 | 3A991.C.3 |
| Is Samacsys | - | N | N |
| Maximum analog input voltage | - | 2.3 V | 2.3 V |
| Converter type | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 code | - | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609 code | - | e4 | e4 |
| length | - | 10 mm | 10 mm |
| Maximum linear error (EL) | - | 0.0305% | 0.0305% |
| Humidity sensitivity level | - | 3 | 3 |
| Number of analog input channels | - | 1 | 1 |
| Number of digits | - | 14 | 14 |
| Number of functions | - | 1 | 1 |
| Number of terminals | - | 64 | 64 |
| Maximum operating temperature | - | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C |
| Output bit code | - | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY |
| Output format | - | PARALLEL, WORD | PARALLEL, WORD |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | HTFQFP | HTFQFP |
| Encapsulate equivalent code | - | TQFP64,.47SQ | TQFP64,.47SQ |
| Package shape | - | SQUARE | SQUARE |
| Package form | - | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | - | 260 | 260 |
| power supply | - | 3.3 V | 3.3 V |
| Certification status | - | Not Qualified | Not Qualified |
| Sampling rate | - | 125 MHz | 125 MHz |
| Sample and hold/Track and hold | - | SAMPLE | SAMPLE |
| Maximum seat height | - | 1.2 mm | 1.2 mm |
| Nominal supply voltage | - | 3.3 V | 3.3 V |
| surface mount | - | YES | YES |
| technology | - | CMOS | CMOS |
| Temperature level | - | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | - | GULL WING | GULL WING |
| Terminal pitch | - | 0.5 mm | 0.5 mm |
| Terminal location | - | QUAD | QUAD |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 10 mm | 10 mm |
| Base Number Matches | - | 1 | 1 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
