D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDFP20,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DFP, FL20,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDFP-F20 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | D FLIP-FLOP |
Maximum Frequency@Nom-Sup | 90000000 Hz |
MaximumI(ol) | 0.048 A |
Number of functions | 8 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL20,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 9.5 ns |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Trigger type | POSITIVE EDGE |
Base Number Matches | 1 |
54FCT273FMQB | 54FCT273LMQB | 54FCT273DMQB | 74FCT273PCQR | 74FCT273PC | 74FCT273SC | |
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Description | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDFP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDFP-F20 | S-XQCC-N20 | R-XDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
MaximumI(ol) | 0.048 A | 0.048 A | 0.048 A | 0.032 A | 0.032 A | 0.032 A |
Number of functions | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DFP | QCCN | DIP | DIP | DIP | SOP |
Encapsulate equivalent code | FL20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns | 13 ns | 13 ns | 13 ns |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |