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CR2512-FX-1212E

Description
RESISTOR, 1W, 1%, 100ppm, 12100ohm, SURFACE MOUNT, 2512, CHIP
CategoryPassive components    The resistor   
File Size189KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Download Datasheet Parametric View All

CR2512-FX-1212E Overview

RESISTOR, 1W, 1%, 100ppm, 12100ohm, SURFACE MOUNT, 2512, CHIP

CR2512-FX-1212E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1966891503
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
JESD-609 codee0
Manufacturer's serial numberCR2512
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.6 mm
Package length6.3 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.1 mm
method of packingTR, EMBOSSED PLASTIC, 7 INCH
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance12100 Ω
Resistor typeFIXED RESISTOR
seriesCR2010/2512(F TOL)
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
PL
IA
Features
NT
Lead free
RoHS compliant*
Power rating at 70 °C: CR2010 - 1/2 W,
CR2512 - 1 W
Tight tolerances of bottom electrode
width
*R
oH
S
CO
Three layer termination process with
nickel barrier prevents leaching and
provides excellent solderability
Suitable for most types of soldering
processes
Standard packaging on tape and reel
M
CR2010/CR2512 - Chip Resistors
Electrical Characteristics
Characteristic
Power Rating @ 70 °C
Operating Temperature Range
Derated to 0 Load at
Maximum Working Voltage
Maximum Overload Voltage
Resistance Range:
1 %, E-96 + E-24
5 %, E-24
Temperature Coefficient:
1 % Tolerance
5 % Tolerance
1 ohm to 10 ohms
Model
CR2010
1/2 W
-55 °C to +125 °C
+125 °C
200 V
400 V
10 ohms to 1 megohm
1 ohm to 10 megohms
0 ohm Jumper <50 milliohms
±100 ppm/°C
±200 ppm/°C
-200 ppm/°C to +500 ppm/°C
Model
CR2512
1W
Derating Curve
Rated power in percentage (%)
100
80
60
40
20
0
-55
0
70
(°C) Ambient temperature
125
For Standard Values Used in Capacitors,
Inductors, and Resistors,
click here.
Chip Dimensions
Dimension
L
W
H
I1
I2
Model
CR2010
5.00 ± 0.20
(0.197 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.60 ± 0.10
(0.024 ± 0.004)
0.60 ± 0.25
(0.024 ± 0.010)
0.60 ± 0.25
(0.024 ± 0.010)
Model
CR2512
6.30 ± 0.20
(0.248 ± 0.008)
3.10 ± 0.20
(0.122 ± 0.008)
0.60 ± 0.15
(0.024 ± 0.006)
0.60 ± 0.25
(0.024 ± 0.010)
0.60 ± 0.25
(0.024 ± 0.010)
I2
L
I2
W
H
Dimensional Drawing
I
1
I
1
g
DIMENSIONS ARE:
MM
(INCHES)
How To Order
CR 2010 - F X - 8252 E LF
Model
(CR = Chip Resistor)
Size
• 2010
• 2512
Resistance Tolerance
F = ±1 % ............Used with “X” TCR code only for values from 10 ohms through 1 megohm.
J = ±5 % ............Used with “W” TCR code for values from 10 ohms through 10 megohms. Used with “/” TCR code for zero ohm (jumper)
and for values from 1 ohm through 9.1 ohms.
TCR (ppm/°C)
X = ±100 ..............Used with “F” Resistance Tolerance code only for values from 10 ohms through 1 megohm.
W = ±200 ..............Used with “J” Resistance Tolerance code only for values from 10 ohms through 10 megohm.
/ = -250 to +500 ..Used with “J” Resistance Tolerance code only for zero ohm (jumper), and for values from 1 ohms through 9.1 ohms.
Resistance Value
For 1 % Tolerance:
<100 ohms..............“R” represents decimal point (example: 24R3 = 24.3 ohms)
≥100
ohms ..............First three digits are significant, fourth digit represents number of zeros to follow (example: 8252 = 82.5k
Ω).
For 5 % Tolerance:
<10 ohms................“R” represents decimal point (example: 4R7 = 4.7 ohms)
≥10
ohms ................First two digits are significant, third digit represents number of zeros to follow (example: 474 = 470k ohms; 000 = Jumper).
Packaging
E = Embossed Plastic Tape (4,000 pcs.) on 7 ” Plastic Reel
Termination
LF = Tin-plated (lead free)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice
Customers should verify actual device performance in their specific applications..

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