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On August 8, 2023, Dalianda Holdings, a leading international semiconductor component distributor committed to the Asia-Pacific market, announced that its subsidiary Shiping launched a computer chass...[Details]
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May 6, 2020 - Recently, TE Connectivity (hereinafter referred to as "TE"), a global leader in connectivity and sensing, announced its second quarter financial report ending March 27, 2020. Sec...[Details]
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I spent an entire night making a 4398CV1 hardware
USB
DAC
prototype. I picked up all the parts at random, so here's a quick preview. Here's the specs. With this good figure, ...[Details]
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Because floating-point operations were inserted into the function before, the program was abnormal. Finally, I consulted relevant information and learned that the floating-point coprocessor VFP of S3...[Details]
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0 Introduction
With
the development of
power
semiconductor
devices, a variety of fully controlled devices have emerged, among which
MOSFET
has become
one of the...[Details]
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Heterogeneous integration is a new trend in the semiconductor industry to extend Moore's Law. As the clustering effect of Taiwan's semiconductor industry expands, the three technology giants, TSMC, A...[Details]
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The correct selection of variable frequency power supply is crucial for the normal operation of the electronic control system of mechanical equipment. When selecting a variable frequency power ...[Details]
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As electronic products continue to develop towards lighter, smaller and thinner shapes, the performance and size of circuit protection devices are becoming more and more stringent. TE Circuit Protecti...[Details]
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In the M1 iPad Pro released early this morning, the new device uses a new chipset and an improved camera system, as well as a new person centering function, which greatly improves performance. The ...[Details]
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One of the ways to improve the quality of electric energy is to reasonably add reactive power compensation equipment to the grid at appropriate locations to compensate for reactive power. As a new ty...[Details]
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On March 21, domestic manufacturer OmniVision announced that its OX08D10 image sensor using TheiaCel technology is compatible with Qualcomm Snapdragon Digital Chassis.
In particular, it ...[Details]
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Now that we understand serialization, let's go back to the previous section. We found that ROS did not use a third-party serialization tool, but chose to implement it itself. The code is in r...[Details]
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Central topics of power modules:
Packaging options for onboard power modules
Power module solutions:
Understanding the thermal performance of power modules from air flow d...[Details]
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After the chip shortage problem has developed for some time, the automotive chip industry is showing two new development trends: one is that production capacity will increase, and the other is that c...[Details]
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The most widely used scenario of inductors is power supply. Both boost circuits and buck circuits require an inductor to store and release energy. Many novice friends are too familiar with the prin...[Details]
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