MSP430F56xx Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA113,12X12,20 |
| Contacts | 113 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| Samacsys Description | MSP430F56xx Mixed Signal Microcontroller |
| Has ADC | YES |
| Other features | OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE |
| Address bus width | |
| bit size | 16 |
| boundary scan | YES |
| CPU series | MSP430 |
| maximum clock frequency | 32 MHz |
| DAC channel | YES |
| DMA channel | YES |
| External data bus width | |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-PBGA-B113 |
| JESD-609 code | e1 |
| length | 7 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of DMA channels | 6 |
| Number of external interrupt devices | 8 |
| Number of I/O lines | 74 |
| Number of serial I/Os | 2 |
| Number of terminals | 113 |
| Number of timers | 4 |
| On-chip data RAM width | |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA113,12X12,20 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2/3.3 V |
| Certification status | Not Qualified |
| RAM (bytes) | 65536 |
| RAM (number of words) | 64 |
| rom(word) | 524288 |
| ROM programmability | FLASH |
| Maximum seat height | 1 mm |
| speed | 20 MHz |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 2.4 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
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