datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> RCG080510016K50.5%EB
PDF
Preview

RCG080510016K50.5%EB

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 16500ohm, 150V, 0.5% +/-Tol, -100,100ppm/Cel, 0805,
CategoryPassive components    The resistor   
File Size118KB，6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

RCG080510016K50.5%EB Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 16500ohm, 150V, 0.5% +/-Tol, -100,100ppm/Cel, 0805,

RCG080510016K50.5%EB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid278429426
Reach Compliance Codecompliant
Country Of OriginIsrael
ECCN codeEAR99
YTEOL8.55
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length2 mm
Package formSMT
Package width1.25 mm
method of packingTR, Paper, 11 1/4 Inch
Rated power dissipation(P)0.125 W
resistance16500 Ω
Resistor typeFIXED RESISTOR
seriesRCG-E3
size code0805
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin (Sn)
Tolerance0.5%
Operating Voltage150 V

RCG080510016K50.5%EB Preview

RCG e3
www.vishay.com
Vishay Draloric
Green Thick Film Chip Resistors
FEATURES
• Green resistor - does not use RoHS exemptions
• Stability
R/R
= 1 % for 1000 h at 70 ° C
•
2 mm pitch packaging option for 0603 size
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
IMPERIAL
CASE
SIZE
METRIC
POWER RATING
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
50
TEMPERATURE
COEFFICIENT
± ppm/K
100
RCG0402
0402
RR1005M
0.063
150
200
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
= 1.5 A
RCG0603
0603
RR1608M
0.1
75
100
200
100
200
100
200
0.5, 1
5
0.5, 1
5
0.5, 1
5
1.0 to 10M
E24; E96
E24
E24; E96
E24
E24; E96
E24
TOLERANCE
±%
RESISTANCE
RANGE
150 to 10M
1.0 to 147
1.0 to 10M
TYPE
SERIES
0.5, 1
5
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
= 2.0 A
RCG0805
0805
RR2012M
0.125
150
1.0 to 10M
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
= 2.5 A
RCG1206
1206
RR3216M
0.25
200
1.0 to 10M
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
= 3.5 A
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Marking: See datasheet “Surface Mount Resistor Marking” (document number 20020).
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation
P
70 (1)
Operating voltage
U
max.
AC
RMS
/DC
Insulation voltage
U
ins
(1 min)
Insulation resistance
Operating temperature range
Mass
UNIT
W
V
V
°C
mg
0.65
2
RCG0402
0.063
50
75
RCG0603
0.1
75
100
> 10
9
- 55 to + 155
5.5
10
RCG0805
0.125
150
200
RCG1206
0.25
200
300
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 01-Sep-14
Document Number: 20047
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
Vishay Draloric
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: RCG080510K0FKEA
R
C
G
0
8
0
5
1
0
K
0
F
K
E
A
TYPE
RCG0402
RCG0603
RCG0805
RCG1206
VALUE
R
= Decimal
K
= Thousand
M
= Million
0000
= 0
Jumper
TOLERANCE
D
= ± 0.5 %
F
= ± 1.0 %
J
= ± 5.0 %
Z
= Jumper
TCR
K
= ± 100 ppm/K
L
= ± 150 ppm/K
N
= ± 200 ppm/K
0
= Jumper
PACKAGING
EA, EB,
EC, ED,
EE, EI,
EL
PRODUCT DESCRIPTION: RCG0805 100 10K 1 % EA
RCG0805
TYPE
RCG0402
RCG0603
RCG0805
RCG1206
100
TCR
± 100
ppm/K
± 150
ppm/K
± 200
ppm/K
10K
RESISTANCE VALUE
10R
= 10
10K
= 10 k
1M
= 1 M
0R0
= Jumper
1%
TOLERANCE
± 0.5 %
±1%
±5%
EA
PACKAGING
EA, EB,
EC, ED,
EE, EI,
EL
PACKAGING
TYPE
RCG0402
EE
EI
ED
EL
RCG0603
EE
EA
EB
EC
EA
RCG0805
EB
EC
EA
RCG1206
EB
EC
50 000
5000
10 000
20 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
Paper tape acc.
to IEC 60268-3
Type 1a
8 mm
4 mm
Paper tape acc.
to IEC 60268-3
Type 1a
8 mm
4 mm
Paper tape acc.
to IEC 60268-3
Type 1a
8 mm
4 mm
Paper tape acc.
to IEC 60268-3
Type 1a
8 mm
2 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
CODE
ED
QUANTITY
10 000
CARRIER TAPE
Paper tape acc.
to IEC 60286-3
Type 1a
WIDTH
8 mm
PITCH
2 mm
330 mm/13"
180 mm/7"
180 mm/7"
REEL DIAMETER
180 mm/7"
Revision: 01-Sep-14
Document Number: 20047
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
Vishay Draloric
DIMENSIONS
in millimeters
SIZE
IMPERIAL
0402
0603
0805
1206
METRIC
RR1005M
RR1608M
RR2012M
RR3216M
L
1.0 ± 0.05
1.55
2.0
3.2
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
DIMENSIONS
W
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
H
T1
T2
0.2 ± 0.1
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
SOLDER PAD DIMENSIONS
REFLOW SOLDERING
a
0.4
0.5
0.7
0.9
b
0.6
0.9
1.3
1.7
l
0.5
1.0
1.2
2.0
0.9
0.9
1.1
0.9
1.3
1.7
1.0
1.3
2.3
WAVE SOLDERING
a
b
l
0.35 ± 0.05 0.25 ± 0.05
0.45 ± 0.05
0.45 ± 0.05
0.55 ± 0.05
0.3 ± 0.2
0.3
+ 0.20
- 0.10
0.45 ± 0.2
FUNCTIONAL PERFORMANCE
Fraction of Rated Dissipation
P
70
100
%
50
0
- 50
0
50
Derating
GREEN REQUIREMENTS
SUBSTANCES
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent Chronium
Polybrominated Biphenyl (PBB)
Polybrominated Diphenyl Ether (PBDE)
Bromine (Br)
Chlorine (Cl)
Sum of Bromine and Chlorine
Antimony (Sb)
Red Phosphorous
100
°C
150
70
Ambient Temperature in
amb
CONCENTRATION LIMIT
< 1000 ppm
< 1000 ppm
< 100 ppm
< 1000 ppm
< 1000 ppm
< 1000 ppm
< 900 ppm
< 900 ppm
1500 ppm max.
< 900 ppm
< 100 ppm
Notes
• No exemptions (e.g. Pb in glass) may be applied to any substances or application for the “Green” category
• All concentration levels are based on homogenous materials
Revision: 01-Sep-14
Document Number: 20047
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
Vishay Draloric
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1
OR BETTER
1 to 10 M
± 0.5 %, ± 1 %
STABILITY CLASS 2
OR BETTER
1 to 10 M
±5%
Stability for product types:
RCG e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.;
Duration acc. to style
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
(20/- 55/20) °C and
(20/125/20) °C
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
Depth 2 mm;
3 times
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
No flashover or breakdown
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
4.17.2
58 (Td)
Solderability
Good tinning ( 95 % covered)
no visible damage
4.8.4.2
4.32
-
21 (Uu
3
)
21 (Uu
1
)
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Temperature
coefficient
Shear
(adhesion)
Substrate bending
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
± 100 ppm/K, ± 150 ppm/K
± 200 ppm/K
No visible damage
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
4.33
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.25.1
-
Endurance at 70 °C
U
=
P
70
x
R
U
max.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (1 %
R
+ 0.05
)
± (0.25 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
4.18.2
58 (Td)
Resistance to
soldering heat
Flamability,
needle flame test
Damp heat,
steady state
Endurance at
upper category
temperature
Electrostatic
discharge
(human body model)
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size
4.35
-
No burning after 30 s
4.24
78 (Cab)
± (1 %
R
+ 0.05
)
± (1 %
R
+ 0.1
)
4.25.3
-
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.40
-
± (1 %
R
+ 0.05
)
Revision: 01-Sep-14
Document Number: 20047
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
Vishay Draloric
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1
OR BETTER
1 to 10 M
STABILITY CLASS 2
OR BETTER
1 to 10 M
Stability for product types:
RCG e3
4.29
45 (XA)
Component solvent
resistance
Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z
1.5 mm;
A
200 m/s
2
;
10 sweeps per axis
U
=
4.37
-
Periodic electric
overload
Single pulse high
voltage overload,
10 μs/700 μs
15 x
P
70
x
R
2 x
U
max.;
0.1 s on; 2.5 s off;
1000 cycles
No visible damage
Marking legible,
no visible damage
4.30
45 (XA)
4.22
6 (Fc)
Vibration, endurance
by sweeping
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
4.27
-
Û
= 10 x
P
70
x
R
2 x
U
max.;
10 pulses
± (1 %
R
+ 0.05
)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 01-Sep-14
Document Number: 20047
5
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Interface circuit between thyristor and TWH7851 switch integrated circuit

High-precision non-contact temperature control circuit 4b

MPY100 voltage divider - functional block diagram

MAX038 multiple waveform oscillator

Application connection diagram of TX-KA841 IGBT driver

What is the surface differential impedance of 4ohm?
Original article by Mr. Yibo Technology Expressway | Liu LijuanSince the advent of 67G vector networks, the number of boards that need to be tested has increased. Today, I would like to share with you...
yvonneGan PCB Design
Initial sample debugging
Since my project needs to use ADC multi-channel acquisition, the previous design [ https://en.eeworld.com/bbs/thread-1168442-1-1.html ] did not notice that the ADC input voltage of RSL10 is basically ...
dql2016 onsemi and Avnet IoT Innovation Design Competition
dsp bootloader c5000
The most troublesome thing when learning DSP is the bootload problem of DSP. When learning 51 before, as long as the program is written and compiled, you can use the burner to burn the *.hex file dire...
fish001 DSP and ARM Processors
Share a few must-read books on machine learning
Illustrated explanation of machine learningEasy to understand with pictures and rich examples..., it will help you explore the performance of the algorithm.Deep Learning (Chinese Edition) 2017 New Boo...
arui1999 Download Centre
C2000 built-in 12-bit ADC energy measurement solution
This application note introduces a solution to implement software energy metering based on the C2000 core and the on-chip 12-bit ADC. C2000 is a 32-bit high-performance real-time microcontroller produ...
灞波儿奔 Microcontroller MCU
The secret to rapid improvement of Linux shell scripts
[align=left][font=-apple-system,][size=4][color=#000000]Hello everyone, I am A Ming. I started to do Linux operation and maintenance training in 2013. There should be hundreds of thousands of friends ...
fish001 Microcontroller MCU
Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components

  1. 45911-0046
  2. ECM24DSSB
  3. 76345-905-30
  4. OC-290-CAD-ST3BF-24.576MHZ
  5. GRM216B11H203MD01J
  6. RM222-020-252-5856
  7. 1M3036-026-3539-010.0-13-CD-02-2
  8. SR1812X7R475KEP2(L)#M123A
  9. BZQ5247C
  10. D2541HMB-19P-BL-G15
  11. 1N4004F
  12. 1206W4F2870T5E

Popular Articles

  1. Let's learn mini2440 bare metal development (Part 2) -- Analysis of S3C2440.s that comes with MDK
  2. Infineon Technologies and Panasonic join forces to accelerate GaN technology development for 650V GaN power devices
  3. Anybus Wireless Bolt CAN: CAN communication via Wi-Fi or Bluetooth
  4. For industrial software that is “better to buy than to make”, where is the “turning point”?
  5. Moto X30 pushes mr1 version update: optimizes performance and power consumption, adds a lot of new features
  6. Honor Magic V foldable phone will be equipped with Snapdragon 8 Gen 1 chip
  7. Exynos4412 Bare Metal Development——IIC Bus
  8. Analog Devices’ RadioVerse® SoCs Help Improve 5G RF Efficiency and Performance
  9. OPPO Find X5 Lite new phone revealed, it is the internationally renamed version of Reno7 5G
  10. AMD Threadripper PRO 5000 workstation processors to be released in March

Technical ResourceMore

  1. Design of 10Gbit/s EPON Asymmetric ONU Optical Module
  2. Cryptography PPT
  3. MK_Gas Sensor Type Range Application Notes CO HS NH High Quality Electrochemical Gas Sensor.pdf
  4. Design of output power detection circuit for audio amplifier switching power supply
  5. [Information]-JIS C6842-2012 Optical polarization wave dispersion test method.pdf
  6. Design of high-precision automatic detection system for weighing sensors
  7. Cordless Voice Module Antenna
  8. Homemade wireless network card antenna 72 pages 4.9M
  9. Research on the Dynamic Test System of the Hydraulic Screw-down System of Hot Rolling Mill
  10. Inductor power consumption and temperature rise calculation

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号