C1812X331K102TO datasheet, PDF

C1812X331K102TO: DescriptionCeramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00033uF, 1812,; CategoryPassive components capacitor; File Size810KB，27 Pages; ManufacturerHoly Stone; Websitehttp://www.holystonecaps.com; Environmental Compliance

Download Datasheet Parametric View All

C1812X331K102TO Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00033uF, 1812,

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	910186347
package instruction	, 1812
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	7.85
capacitance	0.00033 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.25 mm
JESD-609 code	e3
length	4.6 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	TR, PLASTIC, 7 INCH
positive tolerance	10%
Rated (DC) voltage (URdc)	1000 V
size code	1812
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	MATTE TIN OVER NICKEL
Terminal shape	WRAPAROUND
width	3.2 mm

What issues should be paid attention to when developing 51 single-chip microcomputer operating system: [i=s]This post was last edited by fish001 on 2019-6-4 17:43[/i]The 51 series single-chip microcomputer is a high-performance 8-bit single-chip microcomputer launched by Intel Corporation in the United...; fish001 Microcontroller MCU

About msp430 programmer and emulator: [size=4] For MSP430, whether it is simulation or burning programs, it can generally be done through: JTAG, SBW, BSL interfaces. JTAG and SBW interfaces can be used for simulation interfaces, and BSL i...; fish001 Microcontroller MCU

Application of power amplifier in the study of defect location of curved plate of piezoelectric sensor: Experiment name: Research on defect location of curved panels based on piezoelectric sensors Research direction: Curved structures such as aircraft skin, aircraft wings, and wind turbine blades have a...; aigtek01 LED Zone

[GD32E503 Review] 06 Review of SDIO bus driver SD card (Part 1): SD requires high-speed reading and writing, and also needs to be easy to use for embedded devices such as handheld devices. There are two access interfaces: SD mode interface and SPI interface. At the...; caizhiwei Domestic Chip Exchange

What are the advantages of Qorvo's Fusion 5G product portfolio, which won the "Global Electronics Achievement Award"?: Just now, ASPENCORE, a world-renowned media organization, announced its 2019 "Global Electronics Achievement Award" list in Shenzhen. Qorvo's leading Fusion 5G product portfolio won the Microwave RF c...; alan000345 RF/Wirelessly

【Recruitment】RF, chip, engineer: A certain technology company is recruiting [ full-time or part-time]1. Responsible for the design of RF, microwave, and millimeter wave integrated circuit chips; 2. Responsible for the testing and app...; 芯2020 Recruitment

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components