Ordering Information .................................................................................................................................................................... 2
User Programming Interface ..................................................................................................................................... 18
Start-up output frequency and signaling types ........................................................................................................... 18
Any-frequency function ............................................................................................................................................. 19
C/SPI Control Registers...................................................................................................................................................... 28
9 I
Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 28
Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 29
Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 29
Register Address: 0x03. Frac-N PLL Feedback Divider Integer Value and Frac-N PLL Feedback Divider Fraction
Value MSW ............................................................................................................................................................... 30
Register Address: 0x05. Forward Divider, Driver Control ......................................................................................... 30
Register Address: 0x06. Driver Divider, Driver Control ............................................................................................. 31
2
C Operation ........................................................................................................................................................................ 32
10 I
I
2
C protocol ............................................................................................................................................................... 32
I
2
C Timing Specification ............................................................................................................................................ 35
I
2
C Device Address Modes ....................................................................................................................................... 36
Dimensions and Patterns ........................................................................................................................................................... 43
Additional Information ................................................................................................................................................................ 44
Revision History ......................................................................................................................................................................... 45
Rev 1.01
Page 3 of 45
www.sitime.com
SiT3521
1 to 340 MHz Elite Platform I2C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
1
Typ.
–
–
–
–
–
±1
–
–
–
Max.
340
Unit
MHz
Condition
Factory or user programmable, accurate to 6 decimal places
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-10
-20
-25
-50
First Year Aging
F_1y
–
+10
+20
+25
+50
–
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1
st
-year aging at 25°C
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
Temperature Range
Operating Temperature Range
T_use
-20
-40
-40
+70
+85
+105
Supply Voltage
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
V
V
V
V
Extended Commercial
Industrial
Extended Industrial. Available only for I
2
C operation, not SPI.
Input Characteristics – OE Pin
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
–
Vdd
Vdd
kΩ
OE pin
OE pin
OE pin, logic high or logic low
Output Characteristics
Duty Cycle
DC
45
–
–
55
%
Startup and Output Enable/Disable Timing
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
T_start
T_oe_hw
3.0
3.8
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
T_oe_sw
–
–
6.5
µs
Rev 1.01
Page 4 of 45
www.sitime.com
SiT3521
1 to 340 MHz Elite Platform I2C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.15
–
89
58
–
32
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B.
T_jitt
–
0.225
0.1
0.225
0.11
1
0.340
0.14
0.340
0.15
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3 V or 2.5 V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
80
61
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
400
455
50
1.375
50
470
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.1
0.21
0.1
1
0.275
0.12
0.367
0.12
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3 V or 2.5 V
mV
mV
V
mV
ps
f = 156.25MHz See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
First of all, directivity refers to the range of sound that a microphone can record, not how it is used.
Directivity can be divided into omnidirectional, figure-8 and cardioid. To put it simply, omnid...
From: https://hackaday.com/2021/02/08/hands-on-the-risc-v-esp32-c3-will-be-your-new-esp8266/The new ESP32-C3 has a 160M RISC-V core similar to the ESP8266, while including most of the ESP32 peripheral...
1. Introduction With the continuous development of science and technology, especially information technology, the process technology of printed circuit board production has been improved accordingly...
In layman's terms, eMMC = NAND flash memory + flash memory control chip + standard interface package. This article roughly makes the following summaries: (1) The connection between MMC and Host can be...
[align=left][color=rgb(0, 0, 0)][font=Verdana, Arial, Helvetica, sans-serif][size=14px]nRF51/nRF52 includes both GPIO and GPIOTE peripherals. People often confuse the two. Today we will introduce the ...
It took me a week and several nights to finally set up the ESP-IDF development environment. In order to verify whether there are any problems, I compiled a project to see.After ESP-IDF is installed, m...
Enterprises are turning to the edge to drive accelerated business growth and drive business transformation Intel's latest "Intelligent Edge Outlook Report" points out that edge computing is crucial...[Details]
At present, the temperature measurement system in many occasions still uses wired temperature measurement equipment, which is composed of temperature sensors, splitters, temperature measuring ...[Details]
Abstract: Design an IP-BX telephone application system based on FPGA, which is used for the interface connection between the traditional telephone network (PSTN) and the PC. The USB2.0 interface ...[Details]
Controller Area Network (CAN) is a dedicated serial data communication bus developed by Robert Bosch in Germany for the automotive industry in the early 1980s. After years of development, it is now in...[Details]
1 Generation of chaotic images
2. Identification and informatization of chaotic anti-counterfeiting marks
3 Extracting eigenvalues using compl...[Details]
S3C2440A has 5 16-bit timers, each of which can work in interrupt mode or DMA mode. Timers 0, 1, 2, and 3 have PWM functions. Timer 4 is an internal timer and does not have an external output line. T...[Details]
"We worked in an 'unprofitable' industry for 20 years, and then accidentally found ourselves on the track of leading domestic intelligent manufacturing software." Dr. Lv Lingzhi, Chairman and CEO of ...[Details]
By Linas Dauksa, Product Marketing Manager, Keysight Technologies
If you own a data center, you should be aware that artificial intelligence (AI) technology may soon be deployed in...[Details]
On August 23, CATL's 5MWh EnerD series liquid-cooled energy storage prefabricated cabin system successfully achieved the world's first mass production delivery.
New generation 314Ah batt...[Details]
Embedded systems have limited resources, and programs are usually stored in ROM for operation. Before executing programs in ROM, the system hardware and software operating environment need to be initi...[Details]
Correct use of ground resistance tester Reducing the grounding resistance of power line towers can improve the lightning resistance level of the line, reduce lightning accidents, reduce contact volta...[Details]
With the successive appearances of the Samsung Galaxy S20 series and the Xiaomi Mi 10 series flagships, this year's flagship war has officially kicked off. Among the popular models that will be launc...[Details]
In modern home life, smart home has gradually entered people's vision and has been popular. The comprehensive integration of new technologies such as integrated wiring, network communication, secu...[Details]
1. Introduction
The interaction effectiveness between the modules of electric vehicles directly affects the driving efficiency and driving experience of the vehicle. Plug-in hybrid vehicles ca...[Details]