Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Toshiba Semiconductor |
Parts packaging code | TSSOP |
package instruction | TSSOP, TSSOP14,.25 |
Contacts | 14 |
Reach Compliance Code | unknown |
series | LVC/LCX/Z |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e4 |
length | 5 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | OR GATE |
MaximumI(ol) | 0.024 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP14,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing | TAPE AND REEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Prop。Delay @ Nom-Sup | 5.5 ns |
propagation delay (tpd) | 20 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 4.4 mm |