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EPC1064TI32

Description
Configuration Memory, 64KX1, MOS, PQFP32, PLASTIC, TQFP-32
Categorystorage    storage   
File Size381KB,28 Pages
ManufacturerAltera (Intel)
Download Datasheet Parametric Compare View All

EPC1064TI32 Overview

Configuration Memory, 64KX1, MOS, PQFP32, PLASTIC, TQFP-32

EPC1064TI32 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAltera (Intel)
Parts packaging codeQFP
package instructionLQFP, TQFP32,.35SQ,32
Contacts32
Reach Compliance Codecompliant
Other features4 WIRE INTERFACE TO FLEX 8000 DEVICES
Maximum clock frequency (fCLK)6 MHz
I/O typeCOMMON
JESD-30 codeS-PQFP-G32
JESD-609 codee0
length7 mm
memory density65536 bit
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeTQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)220
power supply5 V
Certification statusNot Qualified
Maximum seat height1.27 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
Base Number Matches1
Configuration Devices for
®
ACEX, APEX, FLEX & Mercury Devices
Data Sheet
March 2001, ver. 11
Features
s
s
s
s
s
s
s
s
Serial device family for configuring ACEX
TM
, APEX
TM
(including
APEX 20K, APEX 20KC, and APEX 20KE), FLEX
®
(FLEX 10KE and
FLEX 10KA), and Mercury
TM
devices
Easy-to-use 4-pin interface to ACEX, APEX, FLEX, and Mercury
devices
Low current during configuration and near-zero standby current
5.0-V and 3.3-V operation
Software design support with the Altera
®
Quartus
TM
and
MAX+PLUS
®
II development systems for Windows-based PCs as
well as Sun SPARCstation, and HP 9000 Series 700/800
Programming support with Altera’s Master Programming Unit
(MPU) and programming hardware from Data I/O,
BP Microsystems, and other manufacturers
Available in compact plastic packages (see
Figures 1
and
2)
8-pin plastic dual in-line package (PDIP)
20-pin plastic J-lead chip carrier (PLCC) package
32-pin plastic thin quad flat pack (TQFP) package
EPC2 device has reprogrammable Flash configuration memory
5.0-V and 3.3-V in-system programmability (ISP) through the
built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG)
interface
Built-in JTAG boundary-scan test (BST) circuitry compliant with
IEEE Std. 1149.1
ISP circuitry is compatible with IEEE Std. 1532 for EPC2
configuration device
Supports programming through Serial Vector Format Files
(.svf), Jam
TM
Standard Test and Programming Language
(STAPL) Files (.jam), Jam STAPL Byte-Code Files (.jbc), and the
MAX+PLUS II software via the MasterBlaster
TM
,
ByteBlasterMV
TM
, or BitBlaster
TM
download cable
nINIT_CONF
pin allows a JTAG instruction to initiate APEX,
FLEX, or Mercury device configuration
Can be programmed with Programmer Object Files (.pof) for
EPC1 and EPC1441 devices
Available in 20-pin PLCC and 32-pin TQFP packages
Altera Corporation
A-DS-EPROM-11
1

EPC1064TI32 Related Products

EPC1064TI32 EPC1064LCI20 EPC1064VTI32 EPC1064VLCI20 EPC1441LCI20 EPC1064VLI20
Description Configuration Memory, 64KX1, MOS, PQFP32, PLASTIC, TQFP-32 Configuration Memory, 64KX1, PQCC20, PLASTIC, LCC-20 Configuration Memory, 64KX1, MOS, PQFP32, PLASTIC, TQFP-32 Configuration Memory, 64KX1, PQCC20, PLASTIC, LCC-20 Configuration Memory, 440800X1, PQCC20, PLASTIC, LCC-20 Configuration Memory, 64KX1, MOS, PQCC20, PLASTIC, LCC-20
Parts packaging code QFP QLCC QFP QLCC QLCC QLCC
package instruction LQFP, TQFP32,.35SQ,32 QCCJ, LQFP, TQFP32,.35SQ,32 QCCJ, QCCJ, QCCJ, LDCC20,.4SQ
Contacts 32 20 32 20 20 20
Reach Compliance Code compliant unknown compliant unknown unknown compliant
JESD-30 code S-PQFP-G32 S-PQCC-J20 S-PQFP-G32 S-PQCC-J20 S-PQCC-J20 S-PQCC-J20
memory density 65536 bit 65536 bit 65536 bit 65536 bit 440800 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of terminals 32 20 32 20 20 20
word count 65536 words 65536 words 65536 words 65536 words 440800 words 65536 words
character code 64000 64000 64000 64000 440800 64000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64KX1 64KX1 64KX1 64KX1 440800X1 64KX1
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP QCCJ LQFP QCCJ QCCJ QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE CHIP CARRIER FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING J BEND GULL WING J BEND J BEND J BEND
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Other features 4 WIRE INTERFACE TO FLEX 8000 DEVICES - 4 WIRE INTERFACE TO FLEX 8000 DEVICES - CAN ALSO BE OPERATED AT 4.5 TO 5.5V RANGE 4 WIRE INTERFACE TO FLEX 8000 DEVICES
Base Number Matches 1 1 1 1 - -

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