PCF8563P datasheet, PDF - EEWORLD Datasheet

PCF8563P: DescriptionReal-time clock/calendar; CategoryThe embedded processor and controller Microcontrollers and processors; File Size147KB，30 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/; Environmental Compliance

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PCF8563P Overview

Real-time clock/calendar

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknow
Information access methods	SERIAL, 2 WIRE/I2C
interrupt capability	Y
JESD-30 code	R-PDIP-T8
JESD-609 code	e4
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/5 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
shortest time	SECONDS
Volatile	YES

	PCF8563P	PCF8563T	PCF8563TS	PCF8563
Description	Real-time clock/calendar	Real-time clock/calendar	Real-time clock/calendar	Real-time clock/calendar
Is it Rohs certified?	conform to	conform to	conform to	-
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-
package instruction	DIP, DIP8,.3	SSOP, SSOP8,.25	TSSOP, TSSOP8,.19	-
Reach Compliance Code	unknow	unknow	unknow	-
Information access methods	SERIAL, 2 WIRE/I2C	SERIAL, 2 WIRE/I2C	SERIAL, 2 WIRE/I2C	-
interrupt capability	Y	Y	Y	-
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	-
Number of terminals	8	8	8	-
Maximum operating temperature	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	SSOP	TSSOP	-
Encapsulate equivalent code	DIP8,.3	SSOP8,.25	TSSOP8,.19	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
power supply	2/5 V	2/5 V	2/5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-
surface mount	NO	YES	YES	-
technology	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	-
Terminal pitch	2.54 mm	0.635 mm	0.635 mm	-
Terminal location	DUAL	DUAL	DUAL	-
shortest time	SECONDS	SECONDS	SECONDS	-
Volatile	YES	YES	YES	-

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