M55342M03W1F21C-W datasheet, PDF

M55342M03W1F21C-W: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.2W, 1210000ohm, 75V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1005, CHIP; CategoryPassive components The resistor; File Size101KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

Download Datasheet Parametric View All

M55342M03W1F21C-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 1210000ohm, 75V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1005, CHIP

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	1919882117
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	6.88
JESD-609 code	e4
Manufacturer's serial number	M55342/03
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Package shape	RECTANGULAR PACKAGE
method of packing	WAFFLE PACK
Rated power dissipation(P)	0.2 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	1210000 Ω
Resistor type	FIXED RESISTOR
size code	1005
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Gold (Au)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	75 V

Design and implementation of RDS function based on S1473X: FM radio (FM) has always played a very important role in people's entertainment life. Many manufacturers engaged in consumer electronics design have embedded FM parts in products such as MP3, smart ph...; Jacktang RF/Wirelessly

【GD32450I-EVAL】Onboard SDRAM supports LittleVGL: Previous programs only supported internal RAM, which was too small for a 480*272 screen. To support the entire screen, a 480*272*4-byte space must be allocated, a total of 510K. The onboard chip ends ...; tinnu GD32 MCU

I recently debugged the Fudan Micro FM33LC026N chip and am preparing to trial-produce a batch. Are there any Fudan Micro agents?: I recently debugged the FM33LC026N chip and prepared to trial-produce a batch; I will first purchase 500 pieces....; y-ys Domestic Chip Exchange

Capacitor parallel ripple current: I would like to ask you, in the boost circuit, output capacitors C1 and C2 are connected in parallel, which one has a larger ripple current, C1 close to the switch or C2 close to the load? Please expl...; easthewj Switching Power Supply Study Group

MSP430 interrupt priority, open and close, interrupt nesting: 优先级顺序从高到低为：PORT2_VECTOR (1 * 2u) /* 0xFFE2 Port 2 */PORT1_VECTOR (4 * 2u) /* 0xFFE8 Port 1 */TIMERA1_VECTOR (5 * 2u) /* 0xFFEA Timer A CC1-2, TA */TIMERA0_VECTOR (6 * 2u) /* 0xFFEC Timer A CC0 */ADC_V...; 火辣西米秀 Microcontroller MCU

Is it necessary to use D1 bidirectional TVS in this circuit?: [i=s]This post was last edited by kal9623287 on 2022-7-18 13:53[/i]I saw a senior give a circuit, and after seeing it, I was a little curious and wanted to ask everyone in the forum, Is it necessary t...; kal9623287 Power technology

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components