2 Channel Serial Optimized Communication Controller with DMA
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Infineon |
| Parts packaging code | QFP |
| package instruction | PLASTIC, TQFP-144 |
| Contacts | 144 |
| Reach Compliance Code | compli |
| Address bus width | 24 |
| boundary scan | YES |
| maximum clock frequency | 33 MHz |
| letter of agreement | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
| Data encoding/decoding methods | NRZ; NRZI; FM; BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate | 2 MBps |
| External data bus width | 16 |
| JESD-30 code | S-PQFP-G144 |
| JESD-609 code | e0 |
| length | 20 mm |
| low power mode | YES |
| Number of serial I/Os | 2 |
| Number of terminals | 144 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Encapsulate equivalent code | QFP144,.87SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum slew rate | 50 mA |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 20 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| PEB20542 | PEF20542 | |
|---|---|---|
| Description | 2 Channel Serial Optimized Communication Controller with DMA | 2 Channel Serial Optimized Communication Controller with DMA |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Infineon | Infineon |
| Parts packaging code | QFP | QFP |
| package instruction | PLASTIC, TQFP-144 | PLASTIC, TQFP-144 |
| Contacts | 144 | 144 |
| Reach Compliance Code | compli | _compli |
| Address bus width | 24 | 24 |
| boundary scan | YES | YES |
| maximum clock frequency | 33 MHz | 33 MHz |
| letter of agreement | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
| Data encoding/decoding methods | NRZ; NRZI; FM; BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; FM; BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate | 2 MBps | 2 MBps |
| External data bus width | 16 | 16 |
| JESD-30 code | S-PQFP-G144 | S-PQFP-G144 |
| JESD-609 code | e0 | e0 |
| length | 20 mm | 20 mm |
| low power mode | YES | YES |
| Number of serial I/Os | 2 | 2 |
| Number of terminals | 144 | 144 |
| Maximum operating temperature | 70 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFQFP | LFQFP |
| Encapsulate equivalent code | QFP144,.87SQ,20 | QFP144,.87SQ,20 |
| Package shape | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm |
| Maximum slew rate | 50 mA | 50 mA |
| Maximum supply voltage | 3.6 V | 3.6 V |
| Minimum supply voltage | 3 V | 3 V |
| Nominal supply voltage | 3.3 V | 3.3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 20 mm | 20 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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