Synchronous DRAM, 1MX16, 5.5ns, CMOS, PBGA60
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 106352997 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 5.5 ns |
Maximum clock frequency (fCLK) | 143 MHz |
I/O type | COMMON |
interleaved burst length | 1,2,4,8 |
JESD-30 code | R-PBGA-B60 |
memory density | 16777216 bit |
Memory IC Type | SYNCHRONOUS DRAM |
memory width | 16 |
Number of terminals | 60 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA60,7X15,25 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Continuous burst length | 1,2,4,8,FP |
Maximum standby current | 0.0008 A |
Maximum slew rate | 0.04 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 0.635 mm |
Terminal location | BOTTOM |