FPGA, 1536 CLBS, 322970 GATES, 250 MHz, PQFP240
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | XILINX |
Parts packaging code | BGA |
package instruction | FBGA-256 |
Contacts | 256 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
maximum clock frequency | 250 MHz |
Combined latency of CLB-Max | 0.8 ns |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 384 |
Equivalent number of gates | 57906 |
Number of entries | 176 |
Number of logical units | 1728 |
Output times | 176 |
Number of terminals | 256 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 384 CLBS, 57906 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.2/3.6,2.5 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2 mm |
Maximum supply voltage | 2.625 V |
Minimum supply voltage | 2.375 V |
Nominal supply voltage | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 17 mm |