C0805F562M2RAL7800 datasheet, PDF

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C0805F562M2RAL7800: DescriptionCeramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.0056uF, 0805,; CategoryPassive components capacitor; File Size1MB，7 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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C0805F562M2RAL7800 Overview

Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.0056uF, 0805,

C0805F562M2RAL7800 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	938371719
package instruction	, 0805
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	6.08
capacitance	0.0056 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.9 mm
JESD-609 code	e0
length	2 mm
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	TR, 7 Inch
positive tolerance	20%
Rated (DC) voltage (URdc)	200 V
series	C0805F(200V)
size code	0805
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
width	1.25 mm

C0805F562M2RAL7800 Preview

CERAMIC OPEN MODE CAPACITORS

FEATURES

KEMET’s Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability

of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the poten-

tial for causing catastrophic failures. This product is RoHS Compliant.

Applications:

• Input side filtering (power plane/bus)

• High current applications (battery line)

• Circuits that cannot be fused to open when

short circuits occur due to flex cracks

Markets:

• Automotive

- All applications connected directly to the battery

- Conversion to 42V power system

• Power Conversion

- Raw power input side filtering

OUTLINE DRAWING

W

T

S

L

B

NICKEL PLATE

ELECTRODES

CONDUCTIVE

METALLIZATION

TIN PLATE

TABLE 1 - DIMENSIONS - MILLIMETERS (INCHES)

Metric

EIA

EIA Size

Size

Metric

L - Length

W - Width

Size Code

Code

Size Code Code

L - Length

W - Width

2012

0805

2.00

2.0 (.079) ± .20 (.008)

1.25 (.049) ±

± 0.2

(.008)

1.25 (.049)

.20

(.008)

2012

0805

(.079) ± .20 (.008)

3216

1206

3.2 (.126) ± .20 (.008)

1.6 (.063) ± 0.2

3216

1206

3.20 (.126) ± .20 (.008) 1.60 (.063) ± .20

(.008)

3225

1210

3.2 (.126) ± .20 (.008)

2.5 (.098) ± 0.2 (.008)

3225

1210

3.20

4.5 (.177) ± 0.3 (.012)

2.50 (.098) ± .20

(.012)

(.126) ± .20 (.008)

(.008)

4532

1812

3.2 (.126) ± 0.3

B - Bandwidth

0.50 (.02) ± .25 (.010)

0.50 (.02) ±

± .35

(.010)

.25

(.014)

0.60 (.024)

B - Bandwidth

Separation

0.75 (.030)

N/A

Separation

Note: For thickness dimensions, see Table 2.

C

Style

C - Ceramic

Size Code

0805, 1206, 1210, 1812

1812

F

105

K

1

R

A

C

Specification

F - Open-Mode

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

K = ±10%

M = ±20%

End Metallization

C

=

100%

= Standard

C

Tin Plated

L = 70Sn/30Pb Plated

Failure Rate Level

A = Not Applicable

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

R – X7R (±15%) (-55°C +125°C)

2 = 200V

1 = 100V

Voltage

5 = 50V

3 = 25V

4 = 16V

OPEN-MODE INTERNAL DESIGN

The open-mode dimension (OM)

exceeds the termination bandwidth

dimensions: OM >BW

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

79

Ceramic Surface Mount

CAPACITOR ORDERING INFORMATION

CERAMIC OPEN MODE CAPACITORS

TABLE 2

X7R DIELECTRIC CAPACITANCE RANGE AND THICKNESS TARGETS (mm)

Cap

Code

102

122

152

182

222

272

332

392

472

562

682

822

682

103

822

123

103

153

123

183

153

223

183

273

223

333

273

393

333

473

393

563

473

683

823

563

104

683

124

823

154

104

184

124

224

154

274

184

334

224

394

274

474

334

564

684

394

824

474

105

564

125

684

155

824

185

105

225

125

475

155

685

185

225

475

0805

16V

DD

DG

DD

DG

DD

DG

DD

DG

DE

DG

DE

DG

1206

200V 16V 25V 50V

DD

DG

DD

DG

100V 200V 16V

25V

1210

50V

100V 200V 25V

1812

50V

100V 200V

25V

DD

DG

DD

DG

DD

DG

DD

DG

DD

DG

DD

DG

50V 100V

DD

DG

DD

DG

DD

DG

DD

DG

DD

DG

DD

DG

DD

DG

DD

DE

DD

DG

DD

DE

DG

DD

DG

EC

EG

EC

EG

EC

EG

EC

EH

EC

EH

EC

EG

EC

EG

EC

EG

EC

EG

EC

EH

EC

EG

EC

EG

EC

ED

EG

ED

EC

EG

EC

EG

EC

EH

FD

FG

FD

FH

FD

FH

FD

FJ

FG

FH

FJ

FG

FD

FG

FD

FG

FD

FH

FD

FG

FH

FM

FQ

FM

FD

FG

FD

FG

FD

FG

FH

FG

FJ

FG

FJ

FG

FH

FJ

FM

FD

FG

FD

FG

FD

FH

FG

FH

FG

FJ

FH

FR

FH

FJ

FQ

FR

FQ

FD

FG

FD

FG

FD

FH

FG

FH

FG

FJ

FH

FJ

GB

GD

GB

GD

GB

GN

GB

GD

GN

GB

GD

GB

GD

GB

GN

GB

GD

GN

GB

GC

GB

GD

GF

GB

GK

GC

GM

GD

GF

GK

GM

GB

GC

GB

GF

GB

GK

GC

GL

GF

GK

GL

FM

Thickness

Series

Code

DD

DE

DG

EC

EG

EH

FD

FG

FH

FJ

FM

FR

FQ

GB

GC

GD

GF

GK

GL

GM

GN

DD

DE

DG

EC

ED

EG

EH

FD

FG

FH

FJ

FM

FR

FQ

GB

GC

GD

GF

GK

GL

GM

GN

Dimension

.90 ± .10

1.00 ± .10

1.25 ± .15

.90

.15

1.25 ±

± .10

1.00 ± .10

.90 ± .10

1.60 ± .15

1.60 ± .20

1.60 ±

± .10

.20

.95

.95 ± .10

1.25 ± .15

1.55 ± .15

1.25 ± .15

1.85 ± .20

1.55 ± .15

1.70 ± .20

1.85 ± .20

2.25 ± .20

1.70 ±

± .20

2.5

.20

2.25 ±

± .10

1.0

.20

2.5

1.1

.20

±

± .10

1.25 ± .15

1.0 ± .10

1.50 ± .15

1.1 ± .10

1.60 ± .20

1.25 ± .15

1.90 ± .20

1.50 ± .15

2.00 ± .20

1.70 ± .20

1.60 ± .20

1.90 ± .20

2.00 ± .20

1.70 ± .20

.90 ± .10

7"

7" Reel Qty.

Reel Qty.

4000

2500

4000

2500

4000

2000

4000

2500

2000

2500

2000

1500

2000

1000

1500

1000

13"

Reel Qty.

10000

8000

10000

8000

4000

Reel Qty.

10000

8000

10000

8000

4000

0805

1206

1210

1812

1210

1812

0805

1000

Ceramic Surface Mount

THICKNESS AND PACKAGING INFORMATION

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

g

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

®

KE

T

ME

Embossment

8mm

±.30

(.315

±.012")

or

12mm

±.30

(.472

±.012")

178mm (7.00")

or

330mm (13.00")

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

* Punched paper carrier used for 0402 and 0603 case size.

Case Sizes

≤

1210 are 8 mm tape with 4 mm pitch.

Case Sizes > 1210 are 12 mm tape with 8 mm pitch

Note: TU suffix represents tape and reel

packaging of marked components.

TM suffix represents tape and reel packaging of marked components.

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Grid

placement

courtyard

Placement

Reflow Solder

Dimension

0402

0603

0805

1206

1210

1812

1825

2220

2225

Z

2.14

2.78

3.30

4.50

5.90

7.00

G

0.28

0.68

0.70

1.50

2.30

3.30

X Y(ref) C(ref)

0.74 0.93 1.21

1.08 1.05 1.73

1.60 1.30 2.00

2.00 1.50 3.00

2.90 1.50 3.00

3.70 1.80 4.10

6.90 1.80 4.10

5.50 1.85 5.15

6.80 1.85 5.15

Z

3.18

3.70

4.90

G

Wave Solder

X

0.80

1.10

1.40

2.00

Y(ref) Smin

1.25

1.50

1.70

1.93

2.20

3.20

Not Recommended

Courtyard

C

0.68

0.70

1.50

X

Not Recommended

G

Y

Z

Y

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

93

Packaging

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Performance Notes

1. Cover Tape Break Force:

1.0 Kg Minimum.

2. Cover Tape Peel Strength:

The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8 mm

0.1 Newton to 1.0 Newton (10g to 100g)

12 mm

0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 ±10 mm/minute.

3. Reel Sizes:

Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling:

Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration:

Figure 1

Table 1 — EMBOSSED TAPE DIMENSIONS

(Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

and

12 mm

D

0

E

P

0

4.0 ±0.10

(0.157 ±0.004)

P

2

2.0 ±0.05

(0.079 ±0.002)

T Max

0.600

(0.024)

T

1

Max

0.100

(0.004)

1.5

1.75 ±0.10

+0.10 -0.0

(0.059

(0.069 ±0.004)

+0.004, -0.0)

Pitch

Single

(4 mm)

B

1

Max.

Note 1

4.4

(0.173)

12 mm

Double

(8 mm)

8.2

(0.323)

D

1

Min.

Note 2

1.0

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

F

3.5 ±0.05

P

1

4.0 ±0.10

R Min.

Note 3

25.0

T

2

Max

2.5

(0.098)

W

8.0 ±0.30

(.315 ±0.012)

A

0

B

0

K

0

Note 4

(0.039) (0.138 ±0.002)

1.5

5.5 ±0.05

(0.059) (0.217 ±0.002)

(0.157 ±0.004) (0.984)

8.0 ±0.10

30.0

(0.315 ±0.004) (1.181)

4.6

12.0 ±0.30

(0.181) (0.472 ±0.012)

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A

0

,

B

0

,

and K

0

shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)

94

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Embossed Carrier Tape Configuration (cont.)

20°

Sketch D:

Tape Camber (Top View)

1mm (0.039) Max.

250mm (9.843)

Allowable camber to be 1 mm/250 mm.

1mm (0.039) Max.

400mm (15.75) Min.

Figure 2:

Tape Leader

& Trailer

Dimensions

(Metric

Dimensions

Will Govern)

Figure 3:

Reel Dimensions (Metric Dimensions will govern)

Table 2 – REEL DIMENSIONS (Metric will govern)

Tape Size

8 mm

A Max

330.0

(12.992)

B* Min

1.5

(0.059)

C

13.0 ± 0.20

(0.512 ± 0.008)

D* Min

20.2

(0.795)

N Min

50.0

(1.969)

See

Note 3

Table 1

W

1

8.4

+1.5, -0.0

(0.331

+0.059, -0.0)

12.4

+2.0, -0.0

(0.488

+0.078, -0.0)

W

2

Max

14.4

(0.567)

W

3

7.9 Min

(0.311)

10.9 Max

(0.429)

11.9 Min

(0.469)

15.4 Max

(0.606)

12 mm

330.0

(12.992)

1.5

(0.059)

13.0 ± 0.20

(0.512 ± 0.008)

20.2

(0.795)

18.4

(0.724)

95

Packaging

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