CY7C455-14JI datasheet, PDF - EEWORLD Datasheet

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CY7C455-14JI: DescriptionFIFO, 512X18, 10ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52; Categorystorage storage; File Size435KB，22 Pages; ManufacturerCypress Semiconductor

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CY7C455-14JI Overview

FIFO, 512X18, 10ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52

CY7C455-14JI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	LCC
package instruction	PLASTIC, LCC-52
Contacts	52
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	10 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	71.4 MHz
period time	14 ns
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
length	19.1262 mm
memory density	9216 bit
Memory IC Type	OTHER FIFO
memory width	18
Humidity sensitivity level	1
Number of functions	1
Number of terminals	52
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X18
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.04 A
Maximum slew rate	0.18 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	19.1262 mm
Base Number Matches	1

CY7C455-14JI Related Products

	CY7C455-14JI	CY7C455-14JC	CY7C455-12NC	CY7C455-12JC	CY7C455-30JI	CY7C455-14NC	CY7C457-20JC
Description	FIFO, 512X18, 10ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52	FIFO, 512X18, 10ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52	FIFO, 512X18, 9ns, Synchronous, CMOS, PQFP52, PLASTIC, QFP-52	FIFO, 512X18, 9ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52	FIFO, 512X18, 20ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52	FIFO, 512X18, 10ns, Synchronous, CMOS, PQFP52, PLASTIC, QFP-52	FIFO, 2KX18, 15ns, Synchronous, CMOS, PQCC52, PLASTIC, LCC-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	LCC	QFP	LCC	LCC	QFP	LCC
package instruction	PLASTIC, LCC-52	PLASTIC, LCC-52	PLASTIC, QFP-52	PLASTIC, LCC-52	PLASTIC, LCC-52	PLASTIC, QFP-52	PLASTIC, LCC-52
Contacts	52	52	52	52	52	52	52
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	10 ns	10 ns	9 ns	9 ns	20 ns	10 ns	15 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	71.4 MHz	71.4 MHz	83.3 MHz	83.3 MHz	33.3 MHz	71.4 MHz	50 MHz
period time	14 ns	14 ns	12 ns	12 ns	30 ns	14 ns	20 ns
JESD-30 code	S-PQCC-J52	S-PQCC-J52	S-PQFP-G52	S-PQCC-J52	S-PQCC-J52	S-PQFP-G52	S-PQCC-J52
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	19.1262 mm	19.1262 mm	10 mm	19.1262 mm	19.1262 mm	10 mm	19.1262 mm
memory density	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	18	18	18	18	18	18	18
Number of functions	1	1	1	1	1	1	1
Number of terminals	52	52	52	52	52	52	52
word count	512 words	512 words	512 words	512 words	512 words	512 words	2048 words
character code	512	512	512	512	512	512	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C
organize	512X18	512X18	512X18	512X18	512X18	512X18	2KX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QFP	QCCJ	QCCJ	QFP	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ	QFP52,.52SQ	LDCC52,.8SQ	LDCC52,.8SQ	QFP52,.52SQ	LDCC52,.8SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	FLATPACK	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	2.45 mm	5.08 mm	5.08 mm	2.45 mm	5.08 mm
Maximum standby current	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A
Maximum slew rate	0.18 mA	0.16 mA	0.16 mA	0.16 mA	0.14 mA	0.16 mA	0.14 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	GULL WING	J BEND	J BEND	GULL WING	J BEND
Terminal pitch	1.27 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	30
width	19.1262 mm	19.1262 mm	10 mm	19.1262 mm	19.1262 mm	10 mm	19.1262 mm
Humidity sensitivity level	1	1	-	-	-	3	1
Maker	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

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