hochtemperaturbeständig, Liefermöglichkeiten auf Anfrage
Standard /
Standard
Mounting Type
/
Befestigungsarten
W
T
Z
Float mounted (see page 15)
/
Schwimmend (siehe Seite15)
Clinch nut 4-40 UNC (see page 59)
/
Einnietmutter 4-40 UNC (siehe Seite 59)
Clinch nut M3 (see page 59)
/
Einnietmutter M3 (siehe Seite 59)
Einnietmutter 4-40 UNC, selbstsichernd (siehe Seite 59)
Einnietmutter M3, selbstsichernd (siehe Seite 59)
TS
Clinch nut 4-40 UNC, self locking (see page 59)
ZS
Clinch nut M3, self locking (see page 59)
No. of Contacts /
Polzahl
Shell size /
Gehäusegröße
09
1
15
2
25
3
37
4
50
5
Contact Type /
Kontaktart
P
Pin contacts /
Stiftkontakte
S
Socket contacts /
Buchsenkontakte
Contact Design (e. g.)
/
Kontaktvariante (z. B.)
0
1
4
5
14
Solder pot
/
Löttopf
Straight PCB termination /
Leiterplattenanschluss, gerade
Wire-wrap /
Wire Wrap
Right angled PCB termination /
Leiterplattenanschluss, abgewinkelt
Straight PCB termination
/
Leiterplattenanschluss, gerade
For more contacts see page 16 onwards
/
Weitere Kontakte siehe Seite 16 ff.
Machined contacts /
Gedrehte Kontakte
S
Stamped contacts
/
Gestanzte Kontakte
Direction of Right Angled Contacts
/
Richtung der abgewinkelten Kontakte
Standard /
Standard
R
Reverse (Not available with stamped contacts)
/
Revers (nicht mit gestanzten Kontakten möglich)
Performance Classes Available in Accordance with DIN 41652
/
Lieferbare Gütestufen nach DIN 41652
Standard insulator /
Standardisolierkörper
G1
= 500 Contact cycles
/
Steckzyklen
= Performance class 1
/
Gütestufe 1
G2
= 200 Contact cycles
/
Steckzyklen
= Performance class 2
/
Gütestufe 2
G3
= 50 Contact cycles
/
Steckzyklen
= Performance class 3
/
Gütestufe 3
Pin connector with dimples
/
Stiftsteckverbinder mit Kontaktnoppen
FM insulator /
FM-Isolierkörper
All connectors are in accordance with the standards of performance class 1; no performance class
number necessary! (1.3 µm (51 microinches) Au over Ni)
Alle Steckverbinder erfüllen die Anforderungen der Gütestufe 1; Typenbezeichnung ohne Gütestufen!
(1,3 µm Au über Ni)
Modifications
/
Modifikationen
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
DS 10/2007
9
Technical Data
Technische Daten
Mechanical Data
Mechanische Daten
Mechanical Data
Mechanische Daten
Mating force per signal contact
Steckkraft pro Signalkontakt
Unmating force per signal contact
Ziehkraft pro Signalkontakt
max. torque *
max. Anzugsmoment *
* Not for locking screws
* Nicht für Verriegelungsschrauben
3,4 N
0,2 N
40 Ncm (0,295 ft.lb.)
40 Ncm
Electrical Data
Elektrische Daten
Electrical Data
Elektrische Daten
Current rating at room temperature
Maximale Stromstärke bei Raumtemperatur
Test voltage between 2 contacts / shell and contact
Prüfspannung zwischen 2 Kontakten bzw. Kontakt und Gehäuse
Meets transition resistance requirements per contact pair in line with DIN 41652:
Erfüllt Übergangswiderstand pro Kontaktpaar nach DIN 41652 für:
- Straight contacts
/
gerade Kontakte
- Right angled contacts
/
abgewinkelte Kontakte
- Right angled contacts - 50 way
/
abgewinkelte Kontakte bei 50 Polen
Insulation resistance between contacts
Isolationswiderstand Kontakt / Kontakt
Volume resistivity
Spezifischer Durchgangswiderstand
Dielectric strength
Spezifische Durchschlagsfestigkeit
5A
1200 V / 1 min.
10 m
25 m
35 m
5000 M
10
16
cm
50 kV / mm
Materials and Platings
Materialien und Oberflächen
Materials and Platings
Materialien und Oberflächen
Shell
Gehäuse
Type /
Type
Insulator
Isolierkörper
Steel
Stahl
FH
Polyester, heat resistant,
glass filled (UL94V-0), natural
Polyester,
hochtemperaturbeständig,
glasfaserverstärkt (UL94V-0), natur
150 °C (302 °F)
F
Polyester, glass filled
(UL94V-0), white
Polyester, glasfaserverstärkt
(UL94V-0), weiß
FM
Polyester, glass filled (UL94V-0),
green
Polyester, glasfaserverstärkt
(UL94V-0), grün
Relative temperature index according
to UL 746 B
rel.
Temperaturindex nach
UL 746 B
Heat deflection temperature limit
according to DIN 53461 HDT/A
Formbeständigkeitstemperatur nach
DIN 53461 HDT/A
Sub temperature limit
Untere Grenztemperatur
Shell plating (standard)
Gehäuseoberfläche (Standard)
Shell (standard)
Gehäuse (Standard)
Shell (K120)
Gehäuse (K120)
125 °C (257 °F)
130 °C (266 °F)
200 °C (392 °F)
255 °C ( 491 °F)
210 °C (410 °F)
-55 °C (-67 °F)
Tin plated over nickel
verzinnt über Nickel
-55 °C (-67 °F)
-55 °C (-67 °F)
Yellow chromate over zinc plating
Not RoHS compliant
verzinkt und gelb chromatiert
nicht RoHS konform
Pin connector shell without dimples
Stiftsteckverbindergehäuse ohne
Kontaktnoppen
Tin plated over nickel, pin connector
shell
with
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
mit
Kontaktnoppen
Tin plated over nickel, pin connector
shell
without
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
ohne
Kontaktnoppen
Pin connector shell with dimples
Stiftsteckverbindergehäuse mit Kontaktnoppen
Shell (K121)
Gehäuse (K121)
Contact material
Kontaktmaterial
Copper alloy
Kupfer-Legierung
10
DS 10/2007
TECHNISCHE ÄNDERUNGEN VORBEHALTEN – MAßE IN MILLIMETER (INCHES IN KLAMMERN)
Technical Data
Technische Daten
Modifications
Modifikationen
All FCT D-Sub connectors (including crimp versions etc.) are available in many different combinations of materials and platings. For example, shells can
be supplied in a non – magnetic version made of brass, which can be electroless nickel, or gold plated for use in aerospace technology.
Alle FCT D-Sub Steckverbinder (auch Crimp Versionen, usw.) sind in vielen verschiedenen Material- und Oberflächenkombinationen erhältlich. So z. B.
Gehäuse in nichtmagnetischer Ausführung aus Messing bzw. chemisch vernickelte oder vergoldete Gehäuse für Luft- und Raumfahrtanwendungen.
Contact Arrangements
Polbilder
Face view of socket connector
Blick auf Steckseite Buchsensteckverbinder
Face view of pin connector
Blick auf Steckseite Stiftsteckverbinder
Shell Size
Gehäusegröße
Number of Contacts
Polzahl
Pin Connector, Connecting Side
Stiftsteckverbinder, Ansicht steckseitig
1
9
2
15
3
25
4
37
5
50
DS 10/2007
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
This series of Tektronix touch screen oscilloscopes provides solutions for common test standards, supports various embedded systems, digital protocols, high-speed serial PHY layers, power measurements...
I use the GD32F103Cxx microcontroller. I turned on the PWM function provided by the microcontroller. After initialization, the output can be output normally, but there is a problem that cannot be solv...
Calculation of the lead and lag of the voltage and current of capacitors and inductors, and network reactance1. The waveform can show the lead and lag, but it cannot be seen that it is 90° ahead! How ...
[i=s] This post was last posted by fish001 on 2019-2-11 22:41 Edit[/i] [size=4][color=#000000][backcolor=white] Being an embedded engineer is a laborious process that requires developers to maintain a...
During the event, I chose the ADUCM360 board from ADI. I chose it because of its powerful 24-bit AD and single-chip solution.
Originally, the board was supposed to be shipped from abroad in mid-June a...
2019 has passed quietly for a week, and it is already 2020. At this time, I opened the photos on my phone. Review 2019.
At the beginning of 2019, I had already thought about resigning. As a result, I ...
The demand for efficient power supplies and the reduction in the size of electronic products are driving the development of digital power supply technology and power management technology. Modern...[Details]
Apple launched three iPhone 11 phones this year. The price of the lowest-end iPhone 11 was reduced by 1,000 yuan to 5,499 yuan, while the prices of iPhone 11 Pro and iPhone 11 Pro Max remained at 8,6...[Details]
As the vehicle E/E architecture evolves from distributed to domain-centralized architecture, end-user demand for a better smart driving experience continues to increase, driving the rapid increase in...[Details]
This article mainly discusses the impact of antenna crosstalk impairments, phase noise and timing errors on MIMO downlink system performance, as well as fault diagnosis techniques using a time-cohere...[Details]
Nowadays, vehicle control is developing towards high precision and high safety, and the industry is moving towards intelligence and networking. In this process, the automotive network plays an impo...[Details]
WPG Group launches USB Camera solution for image recognition based on Onsemi and Sunplus products
On October 20, 2021, WPG Holdings, a leading semiconductor component distributor ded...[Details]
Recently, the Shandong Provincial Science and Technology Statistics and Analysis Research Center selected Shandong's "Top Ten Scientific and Technological Achievements" and "Top Ten Scientific and Te...[Details]
Under the wave of AI large models, smart cockpits have entered a new upgrade cycle. According to data from the "High-tech Intelligent Automobile Research Institute", from January to October 2023, t...[Details]
Background of the Science and Technology Innovation Board November 5, 2018 At the opening ceremony of the first China International Import Expo, President Xi Jinping announced that a Science a...[Details]
Whether you like it or not, no one can deny that Tesla is the pioneer and spokesperson of smart electric vehicles. So, what will Apple Car be? Is it a safer, smarter, more advanced Tesla, or somethin...[Details]
The selection of test instruments is very important. Being able to correctly and effectively select test instruments has a great impact on improving our utilization of test instruments. So, what are t...[Details]
1 The development of information network brings huge business opportunities to UPS industry
Market demand and technological progress are the two main driving forces for the development of UPS indust...[Details]
The melt indexer is programmed by a microprocessor according to the standard test process, with fast heating speed and high constant temperature accuracy; after filling, it can quickly restore the co...[Details]
A hysteresis control circuit for a buck-type LED constant current driver chip is designed. The chip adopts a high-side current detection scheme and uses a hysteresis current control method to perform...[Details]
Test/Measurement
京公网安备 11010802033920号
EEWORLD
