Approval sheet
RFBPF Series – 2012(0805)- RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
Halogens Free Product
2.4 GHz ISM Band Working Frequency
P/N: RFBPF2012080AM0T62
*Contents in this sheet are subject to change without prior notice.
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ASC_RFBPF2012080AM0T62_V01
May. 2011
Approval sheet
FEATURES
1.
2.
3.
4.
5.
Miniature footprint: 2.0 X 1.2 X 0.8 mm
Low Insertion Loss
High Rejection on GSM Bands
nd
3
High attenuation on 2170 MHz & 2 harmonic suppressed
LTCC process
APPLICATIONS
1.
2.
2.4GHz ISM band RF applications
Bluetooth, Wireless LAN 802.11b/g/n, HomeRF
CONSTRUCTION
PIN
1
2
3
Connection
Input port
GND
Output port
P1
P2
P3
DIMENSIONS
Figure
Symbol
L
W
T
A
B
C
D
E
F
Dimension (mm)
2.00 ± 0.15
1.25 ± 0.10
0.80 ± 0.10
0.95 ± 0.10
0.275 ± 0.10
0.25 ± 0.10
0.60 ± 0.10
0.175 ± 0.10
0.15 ± 0.10
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ASC_RFBPF2012080AM0T62_V01
May. 2011
Approval sheet
ELECTRICAL CHARACTERISTICS
RFBPF2012080AM0T62
Frequency range
Insertion Loss
VSWR
Impedance
2450± 50 MHz
1.8 dB max at +25°C
2.0 dB max at -40°C ~ +85°C
2.0 max
50
Ω
30@ 860~ 960MHz
30@ 1545~ 1605MHz
Attenuation (min.)
35@ 1710~ 1990MHz
30@ 2170MHz
30@ 4800~ 5000MHz
Operation Temperature Range
Typical Electrical Chart
-40°C ~ +85°C
Specification
SOLDER LAND PATTERN
Figure
Unit : mm
Line width to be designed to match 50
Ω
characteristic impedance, depending on PCB material and thickness.
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ASC_RFBPF2012080AM0T62_V01
May. 2011
Approval sheet
RELIABILITY TEST
Test item
Solderability
JIS C 0050-4.6
JESD22-B102D
Test condition / Test method
*Solder bath temperature:235
±
5°C
*Immersion time:2
±
0.5 sec
Solder:Sn3Ag0.5Cu for lead-free
Leaching
(Resistance to dissolution
of metallization)
IEC 60068-2-58
*Leaching immersion time:30
±
0.5 sec
Solder : SN63A
electrode shall not exceed 25%.
*Solder bath temperature:260
±
5°C
Loss of metallization on the edges of each
Specification
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature:120~150
℃
,
1 minute.
*Solder temperature:270±5°C
*Immersion time:10±1 sec
Solder:Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Drop Test
JIS C 0044
Customer’s specification.
*Height:75 cm
*Test Surface:Rigid surface of concrete
or steel.
*Times:6 surfaces for each units;2
times for each side.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Adhesive Strength
of Termination
JIS C 0051- 7.4.3
Bending test
JIS C 0051- 7.4.1
*Pressurizing force:
5N(≦0603);10N(>0603)
*Test time:10±1 sec
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
Measurement to be made after keeping at
room temperature for 24±2 hours
No remarkable damage or removal of the
termination.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
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ASC_RFBPF2012080AM0T62_V01
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Approval sheet
Temperature cycle
JIS C 0025
1.
2.
3.
4.
30±3 minutes at -40°C±3°C,
10~15 minutes at room temperature,
30±3 minutes at +85°C±3°C,
10~15 minutes at room temperature,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
Vibration
JIS C 0040
*Frequency:10Hz~55Hz~10Hz(1min)
*Total amplitude:1.5mm
*Test times:6hrs.(Two hrs each in three
mutually perpendicular directions)
High temperature
JIS C 0021
*Temperature:85°C±2°C
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Humidity
(steady conditions)
JIS C 0022
*Time:1000+24/-0 hrs.
Measurement to be made after keeping at
room temperature for 24±2 hrs
※
500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature:-40°C±2°C
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Humidity:90% to 95% R.H.
*Temperature:40±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
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ASC_RFBPF2012080AM0T62_V01
May. 2011