IC,SRAM,64X4,CMOS,DIP,18PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1435213488 |
package instruction | DIP, DIP18,.3 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
I/O type | SEPARATE |
JESD-30 code | R-XDIP-T18 |
JESD-609 code | e0 |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Number of terminals | 18 |
word count | 64 words |
character code | 64 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 64X4 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |