EEWORLDEEWORLDEEWORLD

Part Number

Search

TBJA155J020CSLZ0700

Description
Tantalum Capacitor, Polarized, Tantalum (dry/solid), 20V, 5% +Tol, 5% -Tol, 1.5uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size155KB,6 Pages
ManufacturerAVX
Environmental Compliance  
Download Datasheet Parametric View All

TBJA155J020CSLZ0700 Overview

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 20V, 5% +Tol, 5% -Tol, 1.5uF, Surface Mount, 1206, CHIP

TBJA155J020CSLZ0700 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1693879796
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL7.2
capacitance1.5 µF
Capacitor typeTANTALUM CAPACITOR
dielectric materialsTANTALUM (DRY/SOLID)
ESR6500 mΩ
high1.6 mm
JESD-609 codee3
leakage current0.0005 mA
length3.2 mm
Manufacturer's serial numberTBJ
Installation featuresSURFACE MOUNT
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 13 INCH
polarityPOLARIZED
positive tolerance5%
Rated (DC) voltage (URdc)20 V
GuidelineMIL-PRF-55365/8
seriesTBJ(DSCC)
size code1206
surface mountYES
Delta tangent0.06
Terminal surfaceMatte Tin (Sn)
Terminal shapeJ BEND
width1.6 mm
TBJ Series
COTS-Plus – DSCC Dwgs 07016 & 95158
TBJ COTS-Plus series, based on the
CWR11 form factor, is a high reliability
series encompassing the current range of
EIA Low ESR ratings. Qualifications
include DSCC 95158 and DSCC 07016,
the latter having the widest range of case
sizes, capacitance / voltage ratings and
also offering Weibull Grade “B” and “C”
reliability and all MIL-PRF-55365 Rev. G
surge test options (“A”, “B” & “C”).
For Space Level applications, AVX SRC
9000 qualification is recommended.
There are four termination finishes available:
solder plated, fused solder plated, hot sol-
der dipped and gold plated (these corre-
spond to “H”, “K”, “C” and “B” termination,
respectively, per MIL-PRF-55365).
The molding compound has been select-
ed to meet the requirements of UL94V-0
(Flame Retardancy) and outgassing
requirements of NASA SP-R-0022A.
Please refer to the TBJ COTS-Plus
SRC9000 Datasheet for part number
availability.
The TBJ “E” and “V” case size compo-
nents are considered to be MSL 3 in
accordance with J-STD-020.
L
W
H
CASE DIMENSIONS:
millimeters (inches)
W
1
A
S
A
Code
A
EIA
Code
1206
1210
2312
2917
2917
2924
EIA
Metric
3216-18
3528-21
6032-28
7343-31
7343-43
7361-38
L±0.20
(0.008)
3.20 (0.126)
3.50 (0.138)
6.00 (0.236)
7.30 (0.287)
7.30 (0.287)
7.30 (0.287)
W+0.20 (0.008)
-0.10 (0.004)
1.60 (0.063)
2.80 (0.110)
3.20 (0.126)
4.30 (0.169)
4.30 (0.169)
6.10 (0.240)
H+0.20 (0.008)
-0.10 (0.004)
1.60 (0.063)
1.90 (0.075)
2.60 (0.102)
2.90 (0.114)
4.10 (0.162)
3.55 (0.140)
W
1
±0.20
(0.008)
1.20 (0.047)
2.20 (0.087)
2.20 (0.087)
2.40 (0.094)
2.40 (0.094)
3.10 (0.120)
A+0.30 (0.012)
-0.20 (0.008)
0.80 (0.031)
0.80 (0.031)
1.30 (0.051)
1.30 (0.051)
1.30 (0.051)
1.30 (0.051)
S Min.
1.10 (0.043)
1.40 (0.055)
2.90 (0.114)
4.40 (0.173)
4.40 (0.173)
4.40 (0.173)
MARKING
(Brown marking on gold body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
Manufacturer’s ID
Lot Number
B
C
D
E
V
W
1
dimension applies to the termination width for A dimensional area only.
CAPACITANCE AND RATED VOLTAGE, V
R
(EIA VOLTAGE CODE) RANGE
LETTER DENOTES CASE SIZE (ESR LIMITS IN PARENTHESES)
Capacitance
μF
Code
0.15
154
0.22
224
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
1000
475
685
106
156
226
336
476
686
107
157
227
337
477
108
E(200)
A(1500)
A(1400)
B(900)
A(3000)
4V (G)
6V (J)
10V (A)
Rated Voltage DC (V
R
) to 85ºC
16V (C)
20V (D)
25V (E)
35V (V)
50V (T)
A(15000)
A(18000)
A(9500)/B(9500)
A(7900)
A(6600)/B(7000)
C(2000)/D(1500)
D(1200)
D(800)
D(300)
E(300)
D(300,600)
E(400)
A(8000)
A(6000)
A(5000)
A(4000)
A(3500)
A(3000)/B(600)
B(600)
C(300)
B(500)/C(200)
D(175)
C(75,150)
D(125)/E(125)
D(50,125)
E(100)
E(50,150)
E(50,200)/V(40)
A(5000)
A(4000)
A(1800,3000)
A(1000,3200)
B(600)
B(500,700)
C(300)
A(700)/B(425,650)
C (500)
C(200,350)
D(200)
C(80,300)
D(150)/E(150)
C(75,200)
D(50,100)/E(100)
D(50,100)/E(100)
D(50,150)
E(50,100)
D(50,150)
E(50,100)/V(40)
E(50,200)/V(40)
A(5500)
A(3500,5000)
A(2000)
A(1500/B(1200)
A(3000)/B(900)
B(500,800)
B(600)/C(175,375)
B(500)
C(100,300)
D(250)
C(110,350)
D(80,150)
D(150)
D(50,125)
E(100)
D(60,150)/V(45)
V(50)
A(6500)
A(3000)
A(1800,4000)
B(1000)
B(1000)
B(500,1000)
C(700)
B(500)/C(450)
D(275)
B(600)/C(400)
D(275)
C(300)
D(100, 200)
D(100,200)
E(150)
D(70,200)
E(125,200)
V(60)
A(10000)
A(8000)
A(3000,7500)
A(7000)/B(2000)
B(2000)
A(3100)
B(700,1500)
B(700,2800)
C(700)
C(300,500)
D(275)/E(200)
C(275,400)
D(100,200)/E(225)
D(90,300)
E(90,175)
D(175,250)
V(95)
A(12000)
A(8000)
A(7500)
A(7500)/B(5200)
B(2000)
B(1000)
B(1500)
C(600)/D(450)
C(350)/D(400)
E(300)
C(1600)/D(125,300)
E(250)
C(450)/D(100,300)
E(250)
D(125,400)
E(125,300)
D(200,300)
E(300)
E(250)/V(200)
NOTE: EIA standards for Low ESR solid tantalum capacitors allow
an ESR movement of 1.25 times initial limit post mounting.
34
n
SEPTEMBER 2013
GigaDevice GD32307E-START development board recommendation
GigaDevice GD32307E-START development board is equipped with GD32F307, the mainstream chip of GD32 ARM Cortex-M4 microcontroller. It is also one of the designated development boards for the "GigaDevic...
okhxyyo Domestic Chip Exchange
SIMterix-Simplis~6~
Many times we may already have a rough idea of the circuit results and need to perform some basic operations on the circuit waveform, but it still takes some time to continue building the circuit, so ...
xutong Analog electronics
Experience in using MQTT protocol
The MQTT protocol is built on top of the TCP protocol, just like a car chassis can run with four tires, but if you want everyone to drive more comfortably, we still have to add a shell to the chassis....
Jacktang RF/Wirelessly
AD13 duplication pad package problem
I drew a package in AD13 and placed a pad. I want to copy a pad, but it always fails. Can an expert tell me how to do it? Thank you!...
chenbingjy PCB Design
SSD1306 Chinese character mobile demonstration
[i=s]This post was last edited by lemon1394 on 2021-8-18 22:00[/i]Using the frame buffer method to display Chinese characters or pictures, the algorithm becomes very simple. Not only can it be used fo...
lemon1394 MicroPython Open Source section
Using Low Noise Modules in Satellite Applications
The low noise block (LNB) is a key functional block in the receiver chain of a satellite communication system. The LNB basically consists of a low noise amplifier (LNA) chain and a downconverter. Alth...
btty038 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号