Multilayer Ceramic Chip Capacitors
FEATURES
• CLASS II DIELECTRIC, TEMPERATURE STABLE
EAR
• EXCELLENT FREQUENCY CHARACTERISTICS, NON-LINEAR
RoHS
CAPACITANCE CHANGE
Compliant
• HIGHER CAPACITANCE THAN NPO
Includes all homogeneous materials
• NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
*See Part Number System for Details
S
S
f
NMC Series X7R
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
insulation Resistance
Dielectric Withstanding Voltage
Test Conditions (EIA-198-2E)
% Capacitance Change
47pF ~ 0.82μF (see high CV datasheet for higher capacitance values)
±5% (J), ±10% (K), ±20% (M)
-55°C ~ +125°C
±15%Δ max. over temperature range (with 0 Vdc applied)
10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc (see NMC-H Series for higher voltages)
2.5% max. (50Vdc, 100Vdc); 3.5% max. (16Vdc, 25Vdc) 5% max. (10Vdc)
@ 1.0Vrms and 1KHz, +25°C
10,000Megohms min. or 500Megohm/μF min. whichever is less @ +25°C
250% of Rated Voltage for 5 ±1 seconds, 50mA maximum current
1KHz, 1.0V ±0.2Vrms
Voltage Coefficient of Capacitance - X7R
% Capacitance Change
Typical X7R Temperature Coefficient
Temperature °C
DC Volts Applied
Minimum Insulation Resistance
vs. Temperature
Insulation Resistance
(Ω Farads)
10000
Impedance vs. Frequency - X7R
% Dissipation Factor
Impedance
Ω
% Dissipation Factor vs. Temperature
1000
100
10
10
25
100 125
Frequency (MHz)
Temperature °C
Temperature °C
PART NUMBER SYSTEM
NMC 0805 X7R 102 K 50 TRP or TRPLP 3K 7C3 F
Series
* - Part Number Level Identification of X7R MLCCs that do not take RoHS exemption 7C-III
RoHS Compliant
Optional RoHS 7C-III Exemption Free*
Optional Reel Qty (3K=3,000pcs)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF,
fi
rst 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
1
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
B
13 ± 0.5
C
50 min.
100 ± 1.0
100 ± 1.0
D
21 ± 1.0
T max.
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
10” (250 ± 2.0)
13” (330 ± 2.0)
D
7 INCH REEL QUANTITIES*
C
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
01005
8mm
20,000
20,000
0201
8mm
20,000
20,000
0402
8mm
10,000
10,000
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
2,000
5,000
1812
12mm
1,000
2,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
T
A
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
EMBOSSED PLASTIC CARRIER TAPE
D
T
P
o
E
P
2
F
B
o
W
A
o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A
o
B
o
W
F
E
P1
2.0 ± 0.05
8.0 ± 0.3
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.10
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
1.1 ± 0.2
1.9 ± 0.2
0805 1.65 ± 0.2
2.4 ± 0.2
1206
2.0 ± 0.2
3.6 ± 0.2
P0
D0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
4.0 ± 0.1
1.5
+0.1/-0.0
PUNCHED CARRIER TAPE
D
t
1
P
o
E
B
o
F
W
®
t
2
A
o
Component
Pitch
P1
4
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
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