Patented Flip-Chip Series
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Parts packaging code | FLIP-CHIP |
package instruction | R-XUUC-N2 |
Contacts | 2 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Minimum breakdown voltage | 17.8 V |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | TRANS VOLTAGE SUPPRESSOR DIODE |
JESD-30 code | R-XUUC-N2 |
JESD-609 code | e0 |
Maximum non-repetitive peak reverse power dissipation | 600 W |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 150 °C |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
polarity | UNIDIRECTIONAL |
Maximum power dissipation | 2.5 W |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 16 V |
surface mount | YES |
technology | AVALANCHE |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |