1812N301K160NHWM datasheet, PDF

1812N301K160NHWM: DescriptionCeramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0003uF, 1812,; CategoryPassive components capacitor; File Size51KB，4 Pages; ManufacturerKnowles; Websitehttp://www.knowles.com

Download Datasheet Parametric View All

1812N301K160NHWM Overview

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0003uF, 1812,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	883492277
package instruction	, 1812
Reach Compliance Code	compliant
Country Of Origin	Mainland China, USA
ECCN code	EAR99
YTEOL	7.38
capacitance	0.0003 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.65 mm
JESD-609 code	e3
length	4.57 mm
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Waffle Pack
positive tolerance	10%
Rated (DC) voltage (URdc)	16 V
series	1812NH(16-25V,.065)
size code	1812
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
width	3.18 mm

CC2530 printf redirection under IAR: The printf function redirection of CC2530 under IAR is consistent with the method of 8051: The first step is to include the header file: #include[/size] [size=4] [/size] [size=4]The second step is to ...; fish001 Microcontroller MCU

Can the STM32 DMA be set to an interrupt with any index?: For example, if the DMA length is set to 100, there will be a HalfCpltCallback interrupt when the default storage reaches 50, and a CpltCallback interrupt when the default storage reaches 100. If the ...; littleshrimp stm32/stm8

Ground pad processing issues in AD package library: When making a chip in the package library, there is a copper sheet for heat dissipation exposed at the bottom of the chip, which needs to be soldered on the circuit board. How should I deal with it? I...; 风过琴弦 Integrated technical exchanges

I want to buy a complete solution based on HiSilicon 3516EV200 or similar HiSilicon chips.: We want to make our own IPC camera, with a resolution of 2-3 megapixels, with all the functions of a camera, including IE access, desktop client, etc., supporting ONVIF protocol, preferably 28181. Hop...; zty169 Security Electronics

If MSP430F5529 does not use the USB communication module, how to use the 2KB part of USB RAM outside of 8KB?: I am using the [url=http://www.ti.com.cn/product/cn/MSP430F5529][color=#000080]MSP430F5529[/color][/url] microcontroller and IAR6.3 compiler. The internal 8K RAM is not enough, and I found that the US...; zhouhuadong Microcontroller MCU

MS2351M replaces AD8314 RF power detection chip: [i=s]This post was last edited by qq329769206 on 2021-9-30 11:02[/i]...; qq329769206 RF/Wirelessly

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components