EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

VJ1206A180JFCAT2M

Description
Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.000018uF, 1406,
CategoryPassive components    capacitor   
File Size168KB,15 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

VJ1206A180JFCAT2M Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.000018uF, 1406,

VJ1206A180JFCAT2M Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7014280860
package instruction, 1206
Reach Compliance Codecompliant
Country Of OriginIsrael
ECCN codeEAR99
YTEOL7.85
capacitance0.000018 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.7 mm
length3.2 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTR, Plastic, 7 Inch
positive tolerance5%
Rated (DC) voltage (URdc)200 V
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal shapeWRAPAROUND
width1.6 mm
Parity error when sending serial port
Specific phenomenon: Serial port selection 1, baud rate 9600, timer 2. Mode 3 is selected. When sending data, send the data to be sent to ACC first, then TB8=P; Power on, observe with logic analyzer, ...
ena 51mcu
Battery Pack BMS Coulomb Counter Chip Solution
ADI-Maxim's battery pack BMS coulomb meter chip is relatively expensive, and most companies will not use it. Can anyone recommend a domestic chip? Taiwan, Japan, and Korea are also OK. In the past, co...
QWE4562009 DIY/Open Source Hardware
DM365 CMEM allocated memory
#define ALIGN(x, y)(((x + (y-1))/y)*y)// 内存对齐数,不设可分配任意大小 struct buf_info {void *user_addr;unsigned long phy_addr; }; struct buf_info dhavbuffer;static int allocate_dhavbuffer(int size){CMEM_AllocParam...
Jacktang Microcontroller MCU
How to distinguish between pads and vias_Differences between vias and pads
[b][b]Pad and via design[/b][/b][p=24, 2, left][color=rgb(0, 0, 0)][font=宋体, arial][size=14px]Components are fixed on the printed circuit board by soldering the leads to the pads. The function of vias...
luoxiao1116 PCB Design
Could you please tell me what circuit is generally used to implement the 0/4-20mA drive circuit?
Could you please tell me what circuit is generally used to implement the 0/4-20mA drive circuit? I have a plan like this, I wonder how competitive it is? For your referenceAttached datasheet...
zjqmyron Motor Drive Control(Motor Control)
Purpose and characteristics of PCB electrogalvanizing
[align=left][color=#000][font=微软雅黑][size=4] The purpose of PCB electrogalvanizing is to prevent steel objects from being corroded, improve the corrosion resistance and service life of steel, and also ...
ohahaha PCB Design

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号