Standard SRAM, 256KX18, 3.5ns, CMOS, PBGA119, BGA-119
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Objectid | 1164070665 |
package instruction | BGA-119 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 3.5 ns |
Other features | PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) | 166 MHz |
I/O type | COMMON |
JESD-30 code | S-PBGA-B119 |
JESD-609 code | e0 |
memory density | 4718592 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 119 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA119,7X17,50 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.02 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.32 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |