Pb in high temperature solder (exempt per RoHS 2002/95/EC Annex (7))
Obsolete/End of Life Date: 12/31/2014 – Last Time Buy Date: March 31,2015
ABSM2
RoHS/RoHS II Compliant
12.5 x 4.6 x 3.7mm
| | | | | | | | | | | | |
| |
Please consider ABSM3A as an alternative
FEATURES:
• Suitable for RoHS compliant reflow
• Available tight tolerance and
temperature stability
STANDARD SPECIFICATIONS:
Parameters
Available Frequencies
Operation Mode
Operating Temperature
Storage Temperature
Frequency Tolerance @+25°C
Frequency Stability over the Operating
Temperature ( ref. to +25°C)
Equivalent series resistance (R1)
Shunt capacitance (C0)
Load capacitance (CL)
Drive Level
Aging
Insulation Resistance
Table 1. Standard ESR
Frequency (MHz)
3.50 - 3.999
4.000 - 5.999
6.000 - 11.999
12.000 - 32.000 (fund)
30.000 - 35.999 (3rd overtone)
33.000 - 70.000 (3rd overtone)
ESR (Ω)
max.
200
150
100
50
100
80
APPLICATIONS:
• Computers, Modems, Microprocessors
• Communication, Test equipment
• PCMCIA
Units
MHz
-----
-----
-----
ºC
ºC
ppm
ppm
Ω
pF
pF
µW
ppm
MΩ
Notes
3.50 MHz - 30.000 MHz
30.001 MHz - 70.000 MHz
30.001 MHz - 32.000 MHz
Minimum
Typical
Maximum
See Table 2 below
Fundamental:
Standard
3rd Overtone:
Standard
Fundamental:
Option.
See options below
-10
-----
+60
-55
-----
+125
-50
-----
+50
-50
-----
-----
-----
-5
500
Table 2
See options
See options
See options
-----
See table 1 below
-----
18.0
-----
-----
-----
+50
7.0
-----
100
+5
-----
Standard
(See options if
other than STD)
@25°C±3°C
First year
@ 100Vdc ± 15V
Available Frequency List [MHz]
3.579545
3.686400
3.932160
4.000000
4.032000
4.096000
4.194304
4.433619
4.800000
4.915200
5.000000
5.068800
5.120000
5.333333
5.529600
6.000000
6.144000
6.176000
6.400000
7.159090
7.372800
7.680000
8.000000
8.000156
8.192000
9.216000
9.600000
9.830400
10.000000
10.240000
10.240000
11.000000
11.059200
11.289600
12.000000
12.288000
12.352000
12.500000
13.000000
13.500000
14.318180
15.000000
15.360000
16.000000
16.000312
16.257000
16.384000
16.666000
16.667000
16.934400
16.934400
17.734475
18.000000
18.432000
18.869600
19.440000
19.660800
20.000000
20.480000
22.118400
24.000000
24.000140
24.576000
24.704000
25.000000
25.175000
27.000000
28.000000
28.322000
28.636360
29.491200
29.500000
30.000000
32.000000
32.768000
33.000000
33.333000
33.333300
33.868800
34.000000
35.468950
36.000000
40.000000
40.960000
44.000000
45.000000
47.940000
48.000000
48.000000
49.152000
50.000000
53.125000
55.000000
60.000000
64.000000
66.000000
66.666600
9.830000
14.745600 19.200000
(Left blank if standard)
OPTIONS & PART IDENTIFICATION:
ABSM2 -
Frequency in MHz*
Please specify the
frequency in MHz.
e.g. 16.000MHz
Load Capacitance (pF)*
Please specify CL (min
10pF) in pF or S for series
Custom ESR if other
than standard
R□
□:
Specify a value in
Ω
(e.g.: R40)
Operating Temp. *
E: 0°C to +70°C
B: -20°C to +70°C
C: -30°C to +70°C
N: -30°C to +85°C
D: -40°C to +85°C
Freq. Tolerance*
4: ± 30 ppm
MHz -
-
-
-
-
Packaging
Blank: Bulk
T: 1000pcs/reel
Oscillation Mode
F: Fundamental AT for
30MHz<F<32MHz
Freq. Stability*
Y: ± 30 ppm
H: ± 35 ppm
Z: ± 100 ppm
R: ± 150 ppm
*Frequency, Load Capacitance, Frequency
tolerance and stability is subject to availability.
Please contact Abracon for each option for
availability.
ABRACON IS
ISO9001:2008
CERTIFIED
CE RTIFIED
LLC
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised:10.12.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit
www.abracon.com
for Terms and Conditions of Sale
MOLDED PLASTIC SMD MICROPROCESSOR CRYSTAL
ABSM2
OUTLINE DRAWING:
Pb in high temperature solder (exempt per RoHS 2002/95/EC Annex (7))
RoHS/RoHS II Compliant
12.5 x 4.6 x 3.7mm
| | | | | | | | | | | | |
| |
Dimensions: Inches (mm)
TAPE & REEL:
T=Tape and reel (1000pcs/reel)
REFLOW PROFILE:
Dimensions: mm
ATTENTION:
Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated,
Automotive Applications. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application
requiring high reliability where component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme
operating environment, written consent and authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
[i=s]This post was last edited by lvxinn2006 on 2019-1-11 08:55[/i] [size=8pt][font=Tahoma]The development board evaluated in this event[/font]ST NUCLEO-G071RB is provided by STMicroelectronics. Thank...
MicroPython drivers for non-volatile memory These drivers support non-volatile memory chips and the littlefs filesystem.[hide]https://github.com/peterhinch/micropython_eeprom[/hide]...
When I was a child, the radios and televisions at home all had poles that could be flexibly rotated and stretched. Everyone must still remember this pole that could rotate back and forth, and perhaps ...
Last time, we learned to use the ESP8266 development board to create a hotspot, that is, to send radio frequency signals, just like your smartphone can open a hotspot to allow others to connect. The r...
Under the wave of electrification and intelligence, the new energy vehicle industry is accelerating its development, while the safety issues of new energy vehicles are becoming increasingly promine...[Details]
The method of testing a mobile phone charger is very simple. Just remove the transformer on the charger, connect the transformer on the standby side, and measure whether the output voltage of the c...[Details]
In 1994, if someone talked to you about EDA, you would definitely be full of questions; but if you talk about EDA today, maybe the old man playing chess on the street would also "chat" to you for a f...[Details]
1. Introduction
Many MCU beginners always say when they communicate with me that I am a MCU beginner now, how can I learn MCU faster, is there a market for learning MCU? For this question, I ...[Details]
On the morning of August 16, the groundbreaking ceremony for the 10GWH Prussian Blue-based sodium-ion battery production project in Feicheng was held. Yang Hongtao, secretary of the municipal party co...[Details]
Design content and requirements content include: 1. Find literature and learn the working principle of DC motor control; 2. Speed control system design 3. Hardware circuit design, drawing circui...[Details]
Ericsson, Telstra and Qualcomm achieve new uplink speed record of around 1Gbps using 5G dual connectivity and carrier aggregation
SAN DIEGO, December 16, 2021 – Ericsson, Telstra and...[Details]
According to foreign media reports, Hyundai Motor has set up two ultra-high-speed electric vehicle charging devices "Hi-Charger" in Goyang Motor Studio . This device has a DC fast charging capacity o...[Details]
Nissan Motor, Japan's third-largest automaker, said on Thursday that it is grappling with negative conditions such as chip shortages, rising raw material costs and the COVID-19 pandemic, which will r...[Details]
GaN Systems recently announced that Renesas Electronics' new automotive 48V/12V bidirectional DC/DC converter uses GaN Systems to provide power transistors, thereby significantly increasing power den...[Details]
RH850/U2B MCU drives ECU integration for zone and domain control applications with improved performance, safety, and motor control accelerator IP
TOKYO, Japan, November 9, 2021 - Ren...[Details]
Many new cars now come with continuously variable transmissions. For hybrid vehicles, this is even more true. So what is a continuously variable transmission and how does it work?
The ...[Details]
Regarding the recent rumors that Apple intends to deploy RISC-V and avoid the Arm architecture, Arm Taiwan President Zeng Zhiguang said on the 7th that he would not comment on a single customer, but ...[Details]
On July 15, Qualcomm announced the launch of the Qualcomm® Snapdragon™ 855 Plus mobile platform in San Diego, USA. This is an upgraded product of Qualcomm Snapdragon 855. Kedar Kondap, Vice President...[Details]
According to foreign media reports, car manufacturer Jaguar Land Rover (JLR) has applied for a patent to the World Intellectual Property Office, which mainly discusses conveying various information...[Details]