D8086-1B datasheet, PDF - EEWORLD Datasheet

D8086-1B: Description16-BIT, 10MHz, MICROPROCESSOR, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，32 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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D8086-1B Overview

16-BIT, 10MHz, MICROPROCESSOR, CDIP40, CERAMIC, DIP-40

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	DIP
package instruction	CERAMIC, DIP-40
Contacts	40
Reach Compliance Code	unknown
Address bus width	20
bit size	16
boundary scan	NO
maximum clock frequency	10 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
length	52.2605 mm
low power mode	NO
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	COMMERCIAL
Maximum seat height	6.096 mm
speed	10 MHz
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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