935321716557 datasheet, PDF - EEWORLD Datasheet

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935321716557: DescriptionMicrocontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，73 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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935321716557 Overview

Microcontroller

935321716557 Parametric

Parameter Name	Attribute value
Objectid	7371213892
Reach Compliance Code	unknown
JESD-609 code	e3
Humidity sensitivity level	3
Peak Reflow Temperature (Celsius)	260
Terminal surface	TIN
Maximum time at peak reflow temperature	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K20P100M72SF1

Rev. 3, 11/2012

K20 Sub-Family

K20P100M72SF1

Supports: MK20DX128VLL7,

MK20DX256VLL7, MK20DX64VMC7,

MK20DX128VMC7, MK20DX256VMC7

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– USB full-/low-speed On-the-Go controller with on-

chip transceiver

– Controller Area Network (CAN) module

– Two SPI modules

– Two I2C modules

– Five UART modules

– I2S module

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– 16-channel DMA controller, supporting up to 63

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– 12-bit DAC

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................3

1.1 Determining valid orderable parts......................................3

2 Part identification......................................................................3

2.1 Description.........................................................................3

2.2 Format...............................................................................3

2.3 Fields.................................................................................3

2.4 Example............................................................................4

3 Terminology and guidelines......................................................4

3.1 Definition: Operating requirement......................................4

3.2 Definition: Operating behavior...........................................5

3.3 Definition: Attribute............................................................5

3.4 Definition: Rating...............................................................6

3.5 Result of exceeding a rating..............................................6

3.6 Relationship between ratings and operating

requirements......................................................................6

3.7 Guidelines for ratings and operating requirements............7

3.8 Definition: Typical value.....................................................7

3.9 Typical value conditions....................................................8

4 Ratings......................................................................................9

4.1 Thermal handling ratings...................................................9

4.2 Moisture handling ratings..................................................9

4.3 ESD handling ratings.........................................................9

4.4 Voltage and current operating ratings...............................9

5 General.....................................................................................10

5.1 AC electrical characteristics..............................................10

5.2 Nonswitching electrical specifications...............................10

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

Voltage and current operating requirements.........11

LVD and POR operating requirements.................11

Voltage and current operating behaviors..............12

Power mode transition operating behaviors..........13

Power consumption operating behaviors..............14

Designing with radiated emissions in mind...........18

Capacitance attributes..........................................18

6.8.6

6.8.7

6.8.8

6.8.9

6 Peripheral operating requirements and behaviors....................22

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.........................22

JTAG electricals....................................................22

6.2 System modules................................................................25

6.3 Clock modules...................................................................25

6.3.1

6.3.2

6.3.3

MCG specifications...............................................25

Oscillator electrical specifications.........................27

32 kHz Oscillator Electrical Characteristics...........30

6.4 Memories and memory interfaces.....................................30

6.4.1

6.4.2

6.4.3

Flash electrical specifications................................30

EzPort Switching Specifications............................35

Flexbus Switching Specifications..........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications.................................39

CMP and 6-bit DAC electrical specifications.........47

12-bit DAC electrical characteristics.....................49

Voltage reference electrical specifications............52

6.7 Timers................................................................................53

6.8 Communication interfaces.................................................53

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

USB electrical specifications.................................53

USB DCD electrical specifications........................54

USB VREG electrical specifications......................54

CAN switching specifications................................55

DSPI switching specifications (limited voltage

range)....................................................................55

DSPI switching specifications (full voltage range).56

I2C switching specifications..................................58

UART switching specifications..............................58

I2S/SAI Switching Specifications..........................58

6.9 Human-machine interfaces (HMI)......................................63

6.9.1

TSI electrical specifications...................................63

5.3 Switching specifications.....................................................19

5.3.1

5.3.2

Device clock specifications...................................19

General switching specifications...........................19

7 Dimensions...............................................................................64

7.1 Obtaining package dimensions.........................................64

8 Pinout........................................................................................64

8.1 K20 Signal Multiplexing and Pin Assignments..................64

8.2 K20 Pinouts.......................................................................69

9 Revision History........................................................................71

5.4 Thermal specifications.......................................................20

5.4.1

5.4.2

Thermal operating requirements...........................20

Thermal attributes.................................................21

K20 Sub-Family Data Sheet, Rev. 3, 11/2012.

Freescale Semiconductor, Inc.

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