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CHP1/2-50-330RGI

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 2%, 50ppm, 330ohm, SURFACE MOUNT, 2010
CategoryPassive components    The resistor   
File Size359KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

CHP1/2-50-330RGI Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 2%, 50ppm, 330ohm, SURFACE MOUNT, 2010

CHP1/2-50-330RGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1075737408
package instructionMELF, 2010
Reach Compliance Codecompliant
ECCN codeEAR99
structureCylindrical
JESD-609 codee1
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package diameter2.01 mm
Package length5.08 mm
Package shapeCYLINDRICAL PACKAGE
Package formMELF
method of packingTR, 7 INCH
Rated power dissipation(P)0.5 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance330 Ω
Resistor typeFIXED RESISTOR
size code2008
surface mountYES
technologyTHICK FILM/METAL GLAZE
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage300 V
Resistors
Cylindrical High Power
Surface Mount Metal Glaze™
CHP
CHP Series
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
Up to 2 watts
RoHS-compliant version available
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
AEC-Q200
150°C maximum operating temperature
Cylindrical High Power
Metal Glaze™
thick film element
fired at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
High
nickel barrier
temperature
dielectric
coating
nickel barrier
OBSOLETE
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code
1
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Electrical Data
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Maximum
m Change
Maximu
Change
As specified
Test Method
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Test Method
Thermal Shock
Low Temperature Operation
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Moisture Resistance
Exposure
Resistance to Bonding
High Temperature Exposure
±0.5% + 0.01 ohm
±1% for R>100K ohm
±1% for R>100KΩ
±0.5% +.01 Ω
MIL-R-55342H Par 3.12
MIL-PRF-55342H, §4.8.7
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
±1% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Temperature Coefficient
Solderability
Life Test
Moisture Resistance
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
exert pull on chip contacts for 5 seconds
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Solderability
Life Test
±1% +.01 Ω
IRC – defined
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
Chip mounted in center of 90mm long board, deflected 1mm so as to
(no mechanical damage)
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
95%
0.01 ohm
±1% +
minimum coverage
no mechanical damage
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC reserves the right to make changes in product specification
(no mechanical damage)
without notice or liability.
General Note
Terminal Adhesion
Strength (flex)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
General Note
• Facsimile: 361 992 3377 • Website: www.irctt.com
Telephone: 361 992 7900
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
CHP
BI Technologies
Series Issue March
Welwyn
3
IRC
2011 Sheet 1 of
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
© TT Electronics plc
03.19
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