K8P5516UZB-EI4E0 datasheet, PDF

K8P5516UZB-EI4E0: DescriptionFlash, 16MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64; Categorystorage storage; File Size1MB，59 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K8P5516UZB-EI4E0 Overview

Flash, 16MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1032554186
Parts packaging code	BGA
package instruction	TBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	80 ns
Spare memory width	8
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	256
Number of terminals	64
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	128K
Maximum standby current	0.00004 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
width	11 mm

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