Flash, 8MX16, 60ns, PBGA64
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Objectid | 108997632 |
| package instruction | FBGA, BGA64,8X8,32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 60 ns |
| startup block | BOTTOM/TOP |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | S-PBGA-B64 |
| memory density | 134217728 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of departments/size | 16,254 |
| Number of terminals | 64 |
| word count | 8388608 words |
| character code | 8000000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 8MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA64,8X8,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, FINE PITCH |
| page size | 8 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Department size | 4K,32K |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.055 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| switch bit | YES |
| type | NOR TYPE |
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