TE-Power ONE
TE-Power PLUS
Modular Thermogenerator
Evaluation System
Direct Output & Stabilized Voltage
TE-Power PLUS
Low-Power Voltage Source
1. Technology Principles - Milliwatt Energy from Waste Heat
Silicon Substrate
Cold Side
Area for Thermal
Coupling
(
3388
µm x
3364
µm
)
N Legs
Bi
2
Te
3
Based
Compounds
P Legs
Bi
2
Te
3
Based
Compounds
525
µm
3364
µm
338
m
8
µ
525
µm
MPG-D751
thermoelectric generator chip
mounted on Al heat collector along with
digital and analog temperature sensors.
500
µm
3364
µm
700
µm
424
m
8
µ
p contact
n contact
Hot Side
Area for Thermal Coupling
(
4248
µm x
3364
µm
)
Thermoelectric (TE) power generation is based on the
‘Seebeck-Effect’ describing the generation of a voltage
from a heat flux through one or more TE leg pairs
(thermocouples) each composed of p-type and n-type
thermoelectric semiconductor materials. Micropelt uses
compounds of Bismuth (Bi), Antimony (Sb), Tellurium
(Te) and Selenium (Se) because of their useful perfor-
mance at operating temperatures from below room
temperature up to 200 °C.
The output voltage generated is proportional to the
number of thermocouples, the applied temperature
gradient
∆T
across the generator element, and a
constant
α
which describes the material properties.
U = N
legpairs
×
∆T
×
α
U is not dependent on the size of the thermocouple!
This simply means: More thermocouples, regardless of
size, the higher the output voltage from a given
gradient! Our patented MEMS-like thin film micro-
structuring process produces thermogenerators with
the world’s highest feature density of up to 100
thermocouples per mm². This enables a
400 times
higher
output voltage compared to conventional TE
devices.
Wafer-based production ensures easy volume
scalability and attractive economies of scale, making
this technology a preferable option for high volume
self-powered applications.
Still there are the intricacies of designing an efficient
thermal path in order to make the best out of the given
temperature gradients found in harvesting target
locations. The fourth generation of thermal path design
is implemented in the TE-Power BASE which serves as
primary power source in all systems of the family. A
single thermogenerator MPG-D751 generates the
power.
•
TE-Power ONE is targeted for primary TEG power
and thermal path evaluation, with direct power and
temperature sensor output interface.
TE-Power PLUS is the fixed voltage source for
applications which already contain duty cycle
oriented power management. Energy is buffered in a
capacitor which can be customer-extended via a
solder terminal connected in parallel. For best
efficacy matched load operation is recommended.
•
www.micropelt.com | phone +49 761 156 337 0 | info@micropelt.com
0037DSTPP75x0310v5e |
Page 2
TE-Power PLUS
Low-Power Voltage Source
2. TE-Power - Evaluation Unit
Micropelt’s chip-sized energy harvesting technology replaces a finite
battery-based energy supply with infinite free power generated from
local excess heat. Any low power duty-cycle oriented application can
be powered by a thermoharvester. The concept is simple: Use a
small energy buffer which contains at least the energy for a couple
duty cycles. The harvester refills energy consumed by the system’s
active cycle during the much longer latency periods. The system will
run as long as the average incoming power exceeds the average
system power consumption - i.e. with a positive energy balance.
TE-Power
PLUS
Gross
∆T
[K]
(ambient to heat source)
35 (20°C—55°C)
75 (20°C—95°C)
mAh per year
3,628
21,207
Equivalent number
of AA type batteries
2-4
11-20
G
TE
M
D7
G-
P
51
TE-Power ONE—PLUS—NODE evaluation systems help determine the behavior of a chip TEG, the implications of
thermal coupling, the real-life thermoharvesting power budget, and they test-drive customer applications.
Evaluation System Family Overview
Evaluation Kit
Overview
TE-Power NODE
TE-Power PLUS
(this document)
TE-Power ONE
(this document)
Direct
Power
Module
DPM
√
√
√
√
DC
Booster
Module
DBM
Plug-On Modules *
Power
Application
Conditioning Interface
Module
Module
PCM
AIM
√
√
√
Wireless
Sensor
Module
WSM
√
Other *
USB Radio TE-Power
Receiver
SCOPE
Description
Wireless 2,4 GHZ temp. sensing
system with power management
DC-boosted variable output
voltage (1.6 - 5.0 V)
Direct TEG output power with
temp. sensor
√
√
TE-Power NODE System Family
All aspects of thermoharvesting evaluation
and power budget exploration are covered
by this comprehensive system. Depending
on actual customer needs and targeted ap-
plications the system is divided into three
levels of integration. They all build on the
same base module which contains the TEG
chip and a set of analog and digital sensors
for
ΔT
measurements. Power modules in-
clude direct output, boosted constant and
fully regulated voltage, complemented by
versatile upgrade and connection interfaces.
www.micropelt.com | phone +49 761 156 337 0 | info@micropelt.com
0037DSTPP75x0310v5e |
Page 3
TE-Power PLUS
Low-Power Voltage Source
2.1 Features & Benefits of the
TE-Power PLUS
•
High voltage micro-thermogenerator coupled
with best DC conversion efficiency for useful volt-
ages from smallest gradients.
•
•
Analog and digital sensors for precise thermal
measurements
Modular, upgradeable, plug-and-play layout for
flexible exploration of all harvesting and power
budgeting aspects.
•
•
Flexible on-board interfaces for custom enhance-
ments
Optional add-on modules facilitate test-driving of
target application
2.2 Applications
Wireless Sensor Networks (WSN) for:
•
Process Monitoring
•
•
Refineries, chemical plants
Steel, paper, food production
•
Condition Monitoring
•
Motors, engines, bearings, gears, shafts,
etc.
•
•
•
•
Building Automation and
HVAC energy optimization
Enhanced Automated Meter Reading with
real-time energy control features
Active Data Loggers
Thermal triggering & self-powered
switching
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www.micropelt.com | phone +49 761 156 337 0 | info@micropelt.com
0037DSTPP75x0310v5e |
Page 4
TE-Power PLUS
Low-Power Voltage Source
3. System Overview
3.1 Electrical
Direct Power Module
(DPM)
provides raw thermogenera-
tor output and net
∆T
sensor
connections. Also for system
diagnostics.
Application Interface Module
(AIM)
connects custom applications to the
power conditioning module and
provides access to built-in sensors.
Capacitor
Extension
Interface
Application
Power Interface
Serial Power
Conditioning
Interface
Voltage setting
and fixed resistor
terminal
Fixed Application
Power Interface
(not with DPM)
DC Booster Module
(DBM)
•
Fixed voltage 1.6 … 5 V
•
100 µF capacitor buffered
•
Parallel extension interface
•
Fixed resistor terminal
3.2 Mechanical
4 x M1.6 tap holes for
heatsink attachment
Application
Interface
Power
Interface
2 x M2.5
tapped
through-holes
Permanent
magnets
TE-Power BASE
with heatsink adaptor and
routing PCB. Module interfaces and TEG
polarity-inverting DIP switches.
Bottom view of TE-Power BASE
4 permanent magnets and
tapped through holes ensure
easy attachment to multiple
surfaces and custom adaptors.
www.micropelt.com | phone +49 761 156 337 0 | info@micropelt.com
0037DSTPP75x0310v5e |
Page 5
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