TMP87C408LN datasheet, PDF - EEWORLD Datasheet

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TMP87C408LN: Descriptioncmos 8-bit microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，84 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP87C408LN Overview

cmos 8-bit microcontroller

TMP87C408LN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	SDIP, SDIP28,.4
Contacts	28
Reach Compliance Code	unknow
Has ADC	YES
Other features	OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ
Address bus width
bit size	8
CPU series	TLCS-870
maximum clock frequency	4.2 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	25.6 mm
Number of I/O lines	22
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP28,.4
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/4 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	4096
ROM programmability	MROM
Maximum seat height	4.1 mm
speed	8 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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TMP87C408LN Related Products

	TMP87C408LN	TMP87C408DM	TMP87C408LM	TMP87C408M	TMP87C408N	TMP87C808LM	TMP87C808LN
Description	cmos 8-bit microcontroller	cmos 8-bit microcontroller	cmos 8-bit microcontroller	cmos 8-bit microcontroller	cmos 8-bit microcontroller	cmos 8-bit microcontroller	cmos 8-bit microcontroller
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Parts packaging code	DIP	SSOP	SOIC	SOIC	DIP	SOIC	DIP
package instruction	SDIP, SDIP28,.4	LSSOP, SSOP30,.3	SOP, SOP28,.5	SOP, SOP28,.5	SDIP, SDIP28,.4	SOP, SOP28,.5	SDIP, SDIP28,.4
Contacts	28	30	28	28	28	28	28
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Has ADC	YES	YES	YES	YES	YES	YES	YES
Other features	OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ	OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ
bit size	8	8	8	8	8	8	8
CPU series	TLCS-870	TLCS-870	TLCS-870	TLCS-870	TLCS-870	TLCS-870	TLCS-870
maximum clock frequency	4.2 MHz	8 MHz	4.2 MHz	8 MHz	8 MHz	4.2 MHz	4.2 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDIP-T28	R-PDSO-G30	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28
length	25.6 mm	9.7 mm	18.5 mm	18.5 mm	25.6 mm	18.5 mm	25.6 mm
Number of I/O lines	22	22	22	22	22	22	22
Number of terminals	28	30	28	28	28	28	28
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	LSSOP	SOP	SOP	SDIP	SOP	SDIP
Encapsulate equivalent code	SDIP28,.4	SSOP30,.3	SOP28,.5	SOP28,.5	SDIP28,.4	SOP28,.5	SDIP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	IN-LINE, SHRINK PITCH	SMALL OUTLINE	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/4 V	3/5 V	1.8/4 V	3/5 V	3/5 V	1.8/4 V	1.8/4 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256	256	256	256	256
rom(word)	4096	4096	4096	4096	4096	8192	8192
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM	MROM
Maximum seat height	4.1 mm	1.45 mm	2.7 mm	2.7 mm	4.1 mm	2.7 mm	4.1 mm
speed	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.778 mm	0.65 mm	1.27 mm	1.27 mm	1.778 mm	1.27 mm	1.778 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	5.6 mm	8.8 mm	8.8 mm	10.16 mm	8.8 mm	10.16 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
JESD-609 code	e0	e0	e0	e0	e0	-	e0
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)

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