MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC
Parameter Name | Attribute value |
Maker | NXP |
package instruction | SIMM, SSIM72 |
Reach Compliance Code | unknown |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-PSMA-N72 |
memory density | 67108864 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 32 |
Number of terminals | 72 |
word count | 2097152 words |
character code | 2000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX32 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SIMM |
Encapsulate equivalent code | SSIM72 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 25.4 mm |
self refresh | NO |
Maximum standby current | 0.0032 A |
Maximum slew rate | 0.816 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | SINGLE |
Base Number Matches | 1 |
MCM32L230SH70 | MCM32L230SH80 | MCM32L230SHG70 | MCM32L230SHG60 | MCM32230SH80 | |
---|---|---|---|---|---|
Description | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX32,CMOS,SSIM,72PIN,PLASTIC |
Maker | NXP | NXP | NXP | NXP | NXP |
package instruction | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 70 ns | 80 ns | 70 ns | 60 ns | 80 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
memory density | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 |
Number of terminals | 72 | 72 | 72 | 72 | 72 |
word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 2MX32 | 2MX32 | 2MX32 | 2MX32 | 2MX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SIMM | SIMM | SIMM | SIMM | SIMM |
Encapsulate equivalent code | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 |
Maximum seat height | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
self refresh | NO | NO | NO | NO | NO |
Maximum standby current | 0.0032 A | 0.0032 A | 0.0032 A | 0.0032 A | 0.016 A |
Maximum slew rate | 0.816 mA | 0.696 mA | 0.816 mA | 0.976 mA | 0.696 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Base Number Matches | 1 | 1 | 1 | 1 | - |