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MPC8560CVT667JB

Description
32-BIT, 667MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,104 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance
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MPC8560CVT667JB Overview

32-BIT, 667MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

MPC8560CVT667JB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid2055895308
Parts packaging codeBGA
package instructionBGA, BGA783,28X28,40
Contacts783
Reach Compliance Codenot_compliant
ECCN code5A991
Address bus width64
bit size32
boundary scanYES
maximum clock frequency166 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B783
JESD-609 codee2
length29 mm
low power modeYES
Humidity sensitivity level3
Number of terminals783
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA783,28X28,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1.2,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height3.85 mm
speed667 MHz
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width29 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8560EC
Rev. 5, 05/2010
MPC8560 Integrated Processor
Hardware Specifications
The MPC8560 integrates a processor core built on Power
Architecture™ technology with system logic required for
networking, telecommunications, and wireless infrastructure
applications. The MPC8560 is a member of the
PowerQUICC III family of devices that combine
system-level support for industry-standard interfaces with
processors that implement the embedded category of the
Power Architecture technology. For functional
characteristics of the processor, see the
MPC8560
PowerQUICC III Integrated Communications Processor
Reference Manual.
To locate any published errata or updates for this document,
contact your Freescale sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 8
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 17
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ethernet: Three-Speed, MII Management . . . . . . . . 22
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 69
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
System Design Information . . . . . . . . . . . . . . . . . . . 91
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . 98
Document Revision History . . . . . . . . . . . . . . . . . . . 99
© 2010 Freescale Semiconductor, Inc. All rights reserved.

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