IS61DDP2B251236C2-400B4I datasheet, PDF

IS61DDP2B251236C2-400B4I: DescriptionDDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165; Categorystorage storage; File Size882KB，32 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/

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IS61DDP2B251236C2-400B4I Overview

DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165

Parameter Name	Attribute value
Objectid	8087744442
package instruction	LBGA,
Reach Compliance Code	unknown
Country Of Origin	Mainland China, Taiwan
ECCN code	3A991.B.2.A
YTEOL	6.7
Maximum access time	0.45 ns
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	18874368 bit
Memory IC Type	DDR SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.89 V
Minimum supply voltage (Vsup)	1.71 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm

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