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CN35JTNS301

Description
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.0625W, 300ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE
CategoryPassive components    The resistor   
File Size758KB,12 Pages
ManufacturerTA-I Technology Co., Ltd.
Environmental Compliance
Download Datasheet Parametric View All

CN35JTNS301 Overview

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.0625W, 300ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE

CN35JTNS301 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1257496407
package instructionCHIP, LEAD FREE
Reach Compliance Codecompliant
Country Of OriginTaiwan
ECCN codeEAR99
YTEOL8.2
structureChip
The first element resistor300 Ω
JESD-609 codee3
Installation featuresSURFACE MOUNT
Network TypeBUSSED
Number of components8
Number of functions1
Number of terminals10
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTR, PAPER, 7/10 INCH
Rated power dissipation(P)0.0625 W
Rated temperature70 °C
resistance300 Ω
Resistor typeARRAY/NETWORK RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage25 V
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
Document No.
TCN-XX0S001O
Revise Date
page number
2011/06/24
1 /12
(Lead-Free for CN Series Standard)
1. Scope :
This specification applies for the CN series of thick film chip resistor arrays & chip resistor networks made
by TA-I.
2. Construction , Dimensions , Schematic :
2.1 Construction :
Over Coat
Conductor:
(Lead-free )
Resistive Element
Plating
Ni + Sn
Ceramic Substrate
2.1.1 Chip Resistor Arrays :
CN22
CN24/34
CN32
CN28
d
TA-I TECHNOLOGY CO., LTD

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