|
MAX327CPE+ |
MAX327ESE+T |
MAX326CEE+T |
MAX326CSE+T |
MAX326CPE+ |
MAX326ESE+ |
MAX326ESE+T |
MAX326CSE+ |
Description |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
analog switch ics quad spst cmos ultra-low-leakage |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
DIP |
SOIC |
SOIC |
SOIC |
DIP |
SOIC |
SOIC |
SOIC |
package instruction |
DIP, DIP16,.3 |
SOP, SOP16,.25 |
SSOP, SSOP16,.25 |
SOP, SOP16,.25 |
0.300 INCH, PLASTIC, DIP-16 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
Contacts |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compliant |
Factory Lead Time |
6 weeks |
12 weeks |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
8 weeks |
6 weeks |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
19.175 mm |
9.9 mm |
4.9 mm |
9.9 mm |
19.175 mm |
9.9 mm |
9.9 mm |
9.9 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
normal position |
NO |
NO |
NC |
NC |
NC |
NC |
NC |
NC |
Number of channels |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
4 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Nominal off-state isolation |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
On-state resistance matching specifications |
75 Ω |
75 Ω |
75 Ω |
75 Ω |
175 Ω |
75 Ω |
75 Ω |
75 Ω |
Maximum on-state resistance (Ron) |
3500 Ω |
3500 Ω |
3500 Ω |
3500 Ω |
3500 Ω |
3500 Ω |
3500 Ω |
3500 Ω |
Maximum operating temperature |
70 °C |
85 °C |
70 °C |
70 °C |
70 °C |
85 °C |
85 °C |
70 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
SOP |
SSOP |
SOP |
DIP |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
DIP16,.3 |
SOP16,.25 |
SSOP16,.25 |
SOP16,.25 |
DIP16,.3 |
SOP16,.25 |
SOP16,.25 |
SOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
+-15 V |
+-15 V |
+-15 V |
+-15 V |
+-15 V |
+-15 V |
+-15 V |
+-15 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
4.572 mm |
1.75 mm |
1.75 mm |
1.75 mm |
4.572 mm |
1.75 mm |
1.75 mm |
1.75 mm |
Nominal supply voltage (Vsup) |
15 V |
15 V |
15 V |
15 V |
15 V |
15 V |
15 V |
15 V |
surface mount |
NO |
YES |
YES |
YES |
NO |
YES |
YES |
YES |
Maximum disconnect time |
500 ns |
500 ns |
500 ns |
500 ns |
500 ns |
500 ns |
500 ns |
500 ns |
Maximum connection time |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Matte Tin (Sn) |
Tin (Sn) |
Matte Tin (Sn) |
Tin (Sn) |
Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
0.635 mm |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
30 |
NOT SPECIFIED |
30 |
30 |
width |
7.62 mm |
3.9 mm |
3.9 mm |
3.9 mm |
7.62 mm |
3.9 mm |
3.9 mm |
3.9 mm |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
- |
- |
Maxim |
- |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum supply current (Isup) |
- |
- |
0.25 mA |
0.25 mA |
- |
0.25 mA |
0.25 mA |
0.25 mA |